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Journals in DBLP

IBM Journal of Research and Development
2005, volume: 49, number: 4-5

  1. Joel M. Tendler
    Preface. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:503-0 [Journal]
  2. Balaram Sinharoy, Ronald N. Kalla, Joel M. Tendler, Richard J. Eickemeyer, Jody B. Joyner
    POWER5 system microarchitecture. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:505-522 [Journal]
  3. William J. Armstrong, Richard L. Arndt, David C. Boutcher, Robert G. Kovacs, David Larson, Kyle A. Lucke, Naresh Nayar, Randal C. Swanberg
    Advanced virtualization capabilities of POWER5 systems. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:523-532 [Journal]
  4. Paul Mackerras, Thomas S. Mathews, Randal C. Swanberg
    Operating system exploitation of the POWER5 system. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:533-540 [Journal]
  5. Dave W. Victor, John M. Ludden, Richard D. Peterson, Bradley S. Nelson, W. Keith Sharp, James K. Hsu, Bing-Lun Chu, Michael L. Behm, Rebecca M. Gott, Audre D. Romonosky, Steven R. Farago
    Functional verification of the POWER5 microprocessor and POWER5 multiprocessor systems. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:541-554 [Journal]
  6. Harry M. Mathis, Alex E. Mericas, John D. McCalpin, Richard J. Eickemeyer, Steven R. Kunkel
    Characterization of simultaneous multithreading (SMT) efficiency in POWER5. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:555-564 [Journal]
  7. Rebecca M. Gott, Jason Baumgartner, Paul Roessler, S. I. Joe
    Functional formal verification on designs of pSeries microprocessors and communication subsystems. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:565-580 [Journal]
  8. Steven P. Goldman, Lisa M. Mohr, David R. Smith
    Using microcode in the functional verification of an I/O chip. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:581-588 [Journal]
  9. James A. Kahle, Michael N. Day, H. Peter Hofstee, Charles R. Johns, Theodore R. Maeurer, David Shippy
    Introduction to the Cell multiprocessor. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:589-604 [Journal]
  10. Katharine G. Frase, David E. Seeger
    Preface. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:605-0 [Journal]
  11. Sung K. Kang, Paul Lauro, Da-Yuan Shih, Donald W. Henderson, Karl J. Puttlitz
    Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:607-620 [Journal]
  12. Peter A. Gruber, Luc Bélanger, Guy P. Brouillette, David H. Danovitch, Jean-Luc Landreville, David T. Naugle, Valerie A. Oberson, Da-Yuan Shih, Chris L. Tessler, Michel R. Turgeon
    Low-cost wafer bumping. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:621-640 [Journal]
  13. Edmund D. Blackshear, Moises Cases, Erich Klink, Stephen R. Engle, Ronald S. Malfatt, Daniel N. deAraujo, Stefano Oggioni, Luke D. Lacroix, Jamil A. Wakil, Nam H. Pham, Gareth G. Hougham, David J. Russell
    The evolution of build-up package technology and its design challenges. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:641-662 [Journal]
  14. Stephen L. Buchwalter, Peter J. Brofman, Claudius Feger, Michael A. Gaynes, Kang-Wook Lee, Luis J. Matienzo, David L. Questad
    Effects of mechanical stress and moisture on packaging interfaces. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:663-676 [Journal]
  15. Edward J. Yarmchuk, Christopher W. Cline, Dominic C. Bruen
    Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:677-686 [Journal]
  16. Dennis G. Manzer, John P. Karidis, Kathleen M. Wiley, Dominic C. Bruen, Christopher W. Cline, Charles Hendricks, Robert N. Wiggin, Yuet-Ying Yu
    High-speed electrical testing of multichip ceramic modules. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:687-698 [Journal]
  17. Claudius Feger, Jeffrey D. Gelorme, Maurice McGlashan-Powell, Dilhan M. Kalyon
    Mixing, rheology, and stability of highly filled thermal pastes. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:699-708 [Journal]
  18. Roger R. Schmidt, E. E. Cruz, Madhusudan K. Iyengar
    Challenges of data center thermal management. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:709-724 [Journal]
  19. John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Buck C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang
    Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:725-754 [Journal]
  20. Alan F. Benner, Michael Ignatowski, Jeffrey A. Kash, Daniel M. Kuchta, Mark B. Ritter
    Exploitation of optical interconnects in future server architectures. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:755-776 [Journal]
  21. Mary Yvonne Lanzerotti, Giovanni Fiorenza, Rick A. Rand
    Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:777-803 [Journal]
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NOTICE2
The rankings that are presented on this page should NOT be considered as formal since the citation info is incomplete in DBLP
 
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