Journals in DBLP

Microelectronics Reliability
2001, volume: 41, number: 2

1. F. Schwierz, Juin J. Liou
   Semiconductor devices for RF applications: evolution and current status. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2001, v:41, n:2, pp:145-168 [Journal]
   
2. M. M. De Souza, J. Wang, S. K. Manhas, E. M. Sankara Narayanan, A. S. Oates
   A comparison of early stage hot carrier degradation behaviour in 5 and 3 V sub-micron low doped drain metal oxide semiconductor field effect transistors. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2001, v:41, n:2, pp:169-177 [Journal]
   
3. Hei Wong, P. G. Han, M. C. Poon, Y. Gao
   Investigation of the surface silica layer on porous poly-Si thin films. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2001, v:41, n:2, pp:179-184 [Journal]
   
4. M. N. Levin, V. R. Gitlin, S. G. Kadmensky, S. S. Ostrouhov, V. S. Pershenkov
   X-ray and UV controlled adjustment of MOS VLSI circuits threshold voltages. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2001, v:41, n:2, pp:185-191 [Journal]
   
5. Kin P. Cheung
   Unifying the thermal-chemical and anode-hole-injection gate-oxide breakdown models. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2001, v:41, n:2, pp:193-199 [Journal]
   
6. C. T. Hsu, M. M. Lau, Y. T. Yeow
   Analysis of the gate capacitance measurement technique and its application for the evaluation of hot-carrier degradation in submicrometer MOSFETs. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2001, v:41, n:2, pp:201-209 [Journal]
   
7. Robert C. Baumann, Eric B. Smith
   Neutron-induced ¹⁰B fission as a major source of soft errors in high density SRAMs. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2001, v:41, n:2, pp:211-218 [Journal]
   
8. Alexander N. Bubennikov, Andrey V. Zykov
   Investigations of impact ionization phenomena in advanced transistors and speed-power improvement of BiMOS SRAM cells based on reverse base current effect. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2001, v:41, n:2, pp:219-228 [Journal]
   
9. Gábor Harsányi, George Inzelt
   Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2001, v:41, n:2, pp:229-237 [Journal]
   
10. Constance E. Schuster, Mark G. Vangel, Harry A. Schafft
    Improved estimation of the resistivity of pure copper and electrical determination of thin copper film dimensions. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:239-252 [Journal]
    
11. L. Militaru, A. Souifi, M. Mouis, A. Chantre, G. Brémond
    Investigation of deep traps in silicon-germanium epitaxial base bipolar transistors with a single polysilicon quasi self-aligned architecture. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:253-263 [Journal]
    
12. Nicolas Valdaperez, Jean-Marc Routoure, Daniel Bloyet, Régis Carin, Serge Bardy, Jacques Lebailly
    Low-frequency noise in single-poly bipolar transistors at low base current density. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:265-271 [Journal]
    
13. A. C. Lamb, J. F. W. Schiz, J. M. Bonar, F. Cristiano, P. Ashburn, S. Hall, P. L. F. Hemment
    Characterisation of emitter/base leakage currents in SiGe HBTs produced using selective epitaxy. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:273-279 [Journal]
    
14. Jingsong Xie, Michael G. Pecht, David DeDonato, Ali Hassanzadeh
    An investigation of the mechanical behavior of conductive elastomer interconnects. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:281-286 [Journal]
    
15. P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai
    Study of micro-BGA solder joint reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:287-293 [Journal]
    
16. Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dusan Boroyevich, Guo-Quan Lu
    Design issues of a three-dimensional packaging scheme for power modules. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:295-305 [Journal]
    
17. L. Y. Sheng, C. De Tandt, W. Ranson, R. Vounckx
    Reliability aspects of thermal micro-structures implemented on industrial 0.8 mum CMOS chips. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:307-315 [Journal]
    
18. Loren J. Wise, Ronald D. Schrimpf, Harold G. Parks, Kenneth F. Galloway
    A generalized model for the lifetime of microelectronic components, applied to storage conditions. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:317-322 [Journal]
    
19. Asad A. Ismaeel, Rajan Mathew, R. Bhatnagar
    Module allocation with idle-time utilization for on-line testability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:323-332 [Journal]