Journals in DBLP
Guenther Benstetter , Michael W. Ruprecht , Douglas B. Hunt A review of ULSI failure analysis techniques for DRAMs 1. Defect localization and verification. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:307-316 [Journal ] Hei Wong Recent developments in silicon optoelectronic devices. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:317-326 [Journal ] Domenico Caputo , Fernanda Irrera Investigation and modeling of stressed thermal oxides. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:327-333 [Journal ] Fen Chen , Rolf-Peter Vollertsen , Baozhen Li , Dave Harmon , Wing L. Lai A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO2 and nitride-oxide dielectrics. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:335-341 [Journal ] Juin J. Liou , R. Shireen , Adelmo Ortiz-Conde , F. J. García Sánchez , Antonio Cerdeira , Xiaofang Gao , Xuecheng Zou , C. S. Ho Influence of polysilicon-gate depletion on the subthreshold behavior of submicron MOSFETs. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:343-347 [Journal ] Yongseok Ahn , Sanghyun Lee , Gwanhyeob Koh , Taeyoung Chung , Kinam Kim The abnormality in gate oxide failure induced by stress-enhanced diffusion of polycrystalline silicon. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:349-354 [Journal ] Yiqi Zhuang , Lei Du 1/f noise as a reliability indicator for subsurface Zener diodes. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:355-360 [Journal ] A. Caddemi , N. Donato Temperature-dependent noise characterization and modeling of on-wafer microwave transistors. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:361-366 [Journal ] De-Shin Liu , Chin-Yu Ni A thermo-mechanical study on the electrical resistance of aluminum wire conductors. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:367-374 [Journal ] T. Y. Lin , W. S. Leong , K. H. Chua , R. Oh , Y. Miao , J. S. Pan , J. W. Chai The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:375-380 [Journal ] C. F. Luk , Y. C. Chan , K. C. Hung Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:381-389 [Journal ] Joachim Kloeser , Paradiso Coskina , Rolf Aschenbrenner , Herbert Reichl Bump formation for flip chip and CSP by solder paste printing. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:391-398 [Journal ] T. Alander , S. Nurmi , P. Heino , Eero Ristolainen Impact of component placement in solder joint reliability. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:399-406 [Journal ] J. D. Wu , S. H. Ho , C. Y. Huang , C. C. Liao , P. J. Zheng , S. C. Hung Board level reliability of a stacked CSP subjected to cyclic bending. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:407-416 [Journal ] Didier Cottet , Michael Scheffler , Gerhard Tröster A novel, zone based process monitoring method for low cost MCM-D substrates manufactured on large area panels. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:417-426 [Journal ] P. Grybos , W. Dabrowski , P. Hottowy , R. Szczygiel , K. Swientek , P. Wiacek Multichannel mixed-mode IC for digital readout of silicon strip detectors. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:427-436 [Journal ] Asad A. Ismaeel , R. Bhatnagar , Rajan Mathew On-line testable data path synthesis for minimizing testing time. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:437-453 [Journal ] S. Chakraborty , P. T. Lai , Paul C. K. Kwok MOS characteristics of NO-grown oxynitrides on n-type 6H-SiC. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:455-458 [Journal ] F. Saigné , Olivier Quittard , Laurent Dusseau , F. Joffre , C. Oudéa , J. Fesquet , Jean Gasiot Prediction of long-term thermal behavior of an irradiated SRAM based on isochronal annealing measurements. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2002, v:42, n:3, pp:459-461 [Journal ]