Journals in DBLP

Microelectronics Reliability
2003, volume: 43, number: 4

1. Vitezslav Benda
   The quest for optimum technology of power semiconductor devices. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:4, pp:517- [Journal]
   
2. N. Y. A. Shammas
   Present problems of power module packaging technology. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:4, pp:519-527 [Journal]
   
3. Josef Lutz, Martin Domeij
   Dynamic avalanche and reliability of high voltage diodes. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:4, pp:529-536 [Journal]
   
4. J. Vobecký, P. Hazdra, V. Záhlava
   Impact of the electron, proton and helium irradiation on the forward I-V characteristics of high-power P-i-N diode. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:4, pp:537-544 [Journal]
   
5. M. Blaho, Dionyz Pogany, E. Gornik, M. Denison, G. Groos, M. Stecher
   Study of internal behavior in a vertical DMOS transistor under short high current stress by an interferometric mapping method. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:4, pp:545-548 [Journal]
   
6. F. Velardi, F. Iannuzzo, G. Busatto, J. Wyss, A. Candelori
   Experimental study of charge generation mechanisms in power MOSFETs due to energetic particle impact^, . [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:4, pp:549-555 [Journal]
   
7. V. Papez, B. Kojecký, J. Kozísek, J. Hejhal
   Transient effects on high voltage diode stack under reverse bias. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:4, pp:557-564 [Journal]
   
8. B. Morillon, Jean-Marie Dilhac, Christian Ganibal, C. Anceau
   Study of aluminum thermomigration as a low thermal budget technique for innovative power devices. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:4, pp:565-569 [Journal]
   
9. Adeline Feybesse, Ivana Deram, Jean-Michel Reynes, Eric Moreau
   Copper metallization influence on power MOS reliability. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:4, pp:571-576 [Journal]
   
10. Giovanni Busatto, Roberto La Capruccia, Francesco Iannuzzo, Francesco Velardi, Roberto Roncella
    MAGFET based current sensing for power integrated circuit. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:577-583 [Journal]
    
11. Hei Wong
    Low-frequency noise study in electron devices: review and update. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:585-599 [Journal]
    
12. Minkyu Je, Jeonghu Han, Hyungcheol Shin, Kwyro Lee
    A simple four-terminal small-signal model of RF MOSFETs and its parameter extraction. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:601-609 [Journal]
    
13. Jackie Chan, Hei Wong, M. C. Poon, C. W. Kok
    Oxynitride gate dielectric prepared by thermal oxidation of low-pressure chemical vapor deposition silicon-rich silicon nitride. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:611-616 [Journal]
    
14. S. K. Manhas, D. Chandra Sekhar, A. S. Oates, M. M. De Souza
    Characterisation of series resistance degradation through charge pumping technique. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:617-624 [Journal]
    
15. C. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey, Hua Lu
    The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:625-633 [Journal]
    
16. C. Hillman, B. Castillo, Michael G. Pecht
    Diffusion and absorption of corrosive gases in electronic encapsulants. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:635-643 [Journal]
    
17. P. Heino, Eero Ristolainen
    Strength of Ta-Si interfaces by molecular dynamics. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:645-650 [Journal]
    
18. W. L. Pearn, G. H. Lin
    A reliable procedure for testing linear regulators with one-sided specification limits based on multiple samples. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:651-664 [Journal]
    
19. V. A. Gritsenko, A. V. Shaposhnikov, Yu. N. Novikov, A. P. Baraban, Hei Wong, G. M. Zhidomirov, M. Roger
    Onefold coordinated oxygen atom: an electron trap in the silicon oxide. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:665-669 [Journal]
    
20. N. A. Hastas, C. A. Dimitriadis, F. V. Farmakis, G. Kamarinos
    Effects of hydrogenation on the performance and stability of p-channel polycrystalline silicon thin-film transistors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:671-674 [Journal]
    
21. Z. Synowiec, B. Paszkiewicz
    Electron transport in implant isolation GaAs layers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:675-679 [Journal]
    
22. Johan Liu
    Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:681-683 [Journal]
    
23. Mile K. Stojcev
    System Design with System C; Thorsten Grotker, Stan Liao, Grant Martin, Stuart Swan. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp 217, plus X, ISBN 1-4020-7027-1. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:683-684 [Journal]