Journals in DBLP
Nathalie Labat , André Touboul Editorial. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1351-1352 [Journal ] James H. Stathis , Barry P. Linder , R. Rodríguez , Salvatore Lombardo Reliability of ultra-thin oxides in CMOS circuits. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1353-1360 [Journal ] D. Dufourt , J. L. Pelloie SOI design challenges. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1361-1367 [Journal ] Lawrence C. Wagner Trends in Failure Analysis. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1369-1375 [Journal ] A. Andreini , C. Neva , L. Renard , G. Sironi , F. Speroni , L. Sponton , F. Tampellini , R. Tiziani Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1377-1382 [Journal ] Th. Nirschl , M. Ostermayr , A. Olbrich , D. Vietzke , M. Omer , C. Linnenbank , U. Schaper , Y. Pottgiesser , J. Pottgiesser , M. Johansson MALTY--A memory test structure for analysis in the early phase of the technology development. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1383-1387 [Journal ] G. Aichmayr Correlation of gate oxide reliability and product tests on leading edge DRAM technology. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1389-1393 [Journal ] A. Aal A procedure for reliability control and optimization of mixed-signal smart power CMOS pocesses. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1395-1400 [Journal ] P. Charpenel , F. Davenel , R. Digout , M. Giraudeau , M. Glade , J. P. Guerveno , N. Guillet , A. Lauriac , S. Male , D. Manteigas The right way to assess electronic system reliability: FIDES. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1401-1404 [Journal ] Yong-Ha Song , S. G. Kim , S. B. Lee , K. J. Rhee , T. S. Kim A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1405-1410 [Journal ] G. Cassanelli , Fausto Fantini , G. Serra , S. Sgatti Reliability in automotive electronics: a case study applied to diesel engine control. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1411-1416 [Journal ] Gerald Lucovsky Electronic structure of transition metal/rare earth alternative high-K gate dielectrics: interfacial band alignments and intrinsic defects. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1417-1426 [Journal ] Jong-Tae Park , Nag Jong Choi , Chong-Gun Yu , Seok Hee Jeon , Jean-Pierre Colinge Increased hot carrier effects in Gate-All-Around SOI nMOSFET's. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1427-1432 [Journal ] M. Fadlallah , C. Petit , A. Meinertzhagen , G. Ghibaudo , M. Bidaud , O. Simonetti , F. Guyader Influence of nitradation in ultra-thin oxide on the gate current degradation of N and PMOS devices. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1433-1438 [Journal ] R. Rodríguez , James H. Stathis , Barry P. Linder , R. V. Joshi , C. T. Chuang Influence and model of gate oxide breakdown on CMOS inverters. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1439-1444 [Journal ] F. Lime , G. Ghibaudo , B. Guillaumot Charge trapping in SiO2/HfO2/TiN gate stack. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1445-1448 [Journal ] Yuan Li , Klaas Jelle Veenstra , Jerôme Dubois , Lei Peters-Wu , Agnes van Zomeren , Fred G. Kuper Reservoir effect and maximum allowed VIA misalignment for AlCu interconnect with tungsten VIA plug. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1449-1454 [Journal ] S. Djoric-Veljkovic , I. Manic , V. Davidovic , S. Golubovic , Ninoslav Stojadinovic Effects of burn-in stressing on post-irradiation annealing response of power VDMOSFETs. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1455-1460 [Journal ] Young Pil Kim , Uin Chung , Joo Tae Moon , Sang U. Kim Electrical analysis of DRAM cell transistors for the root-cause addressing of the tRDL time-delay failure. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1461-1464 [Journal ] Werner Frammelsberger , Guenther Benstetter , Thomas Schweinboeck , Richard J. Stamp , Janice Kiely Characterization of thin and ultra-thin SiO2 films and SiO2 /Si interfaces with combined conducting and topographic atomic force microscopy. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1465-1470 [Journal ] K. L. Pey , C. H. Tung , M. K. Radhakrishnan , L. J. Tang , Y. Sun , X. D. Wang , W. H. Lin Correlation of failure mechanism of constant-current-stress and constant-voltage-stress breakdowns in ultrathin gate oxides of nMOSFETs by TEM. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1471-1476 [Journal ] Se Re Na Yun , Won Sub Park , Byung Ha Lee , Jong-Tae Park Hot electron induced punchthrough voltage of p-channel SOI MOSFET's at room and elevated temperatures. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1477-1482 [Journal ] S. Aresu , Ward De Ceuninck , G. Knuyt , J. Mertens , J. Manca , Luc De Schepper , Robin Degraeve , Ben Kaczer , Marc D'Olieslaeger , Jan D'Haen A new method for the analysis of high-resolution SILC data. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1483-1488 [Journal ] D. Zander , F. Saigné , A. Meinertzhagen , C. Petit Contribution of oxide traps on defect creation and LVSILC conduction in ultra thin gate oxide devices. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1489-1493 [Journal ] Andreas Gehring , F. Jiménez-Molinos , Hans Kosina , A. Palma , F. Gámiz , Siegfried Selberherr Modeling of retention time degradation due to inelastic trap-assisted tunneling in EEPROM devices. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1495-1500 [Journal ] M. Porti , M. Nafría , X. Aymerich Oxide conductivity increase during the progressive-breakdown of SiO2 gate oxides observed with C-AFM. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1501-1505 [Journal ] Joachim C. Reiner Pre-breakdown leakage current fluctuations of thin gate oxide. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1507-1512 [Journal ] B. Mongellaz , F. Marc , Y. Danto Ageing simulation of MOSFET circuit using a VHDL-AMS behavioural modelling: an experimental case study. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1513-1518 [Journal ] D. Faure , D. Bru , C. Ali , C. Giret , K. Christensen Gate oxide breakdown characterization on 0.13mum CMOS technology. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1519-1523 [Journal ] Jan Ackaert , Klara Bessemans , Eddy De Backer Charging induced damage by photoconduction through thick inter metal dielectrics. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1525-1529 [Journal ] Hamid Toutah , Boubekeur Tala-Ighil , Jean-François Llibre , B. Boudart , Taieb Mohammed-Brahim , Olivier Bonnaud Degradation in polysilicon thin film transistors related to the quality of the polysilicon material. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1531-1535 [Journal ] S. Trinh , Markus P. J. Mergens , Koen G. Verhaege , Christian C. Russ , John Armer , Phillip Jozwiak , Bart Keppens , Russ Mohn , G. Taylor , Frederic De Ranter Multi-finger turn-on circuits and design techniques for enhanced ESD performance and width scaling. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1537-1543 [Journal ] Masashi Hayashi , Shinji Nakano , Tetsuaki Wada Dependence of copper interconnect electromigration phenomenon on barrier metal materials. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1545-1550 [Journal ] M. Zecri , P. Besse , P. Givelin , M. Nayrolles , M. Bafleur , N. Nolhier Determination of the ESD Failure Cause Through its Signature. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1551-1556 [Journal ] V. Dubec , Scrgey Bychikhin , M. Blaho , Dionyz Pogany , E. Gornik , J. Willemen , N. Qu , Wolfgang Wilkening , L. Zullino , A. Andreini A dual-beam Michelson interferometer for investigation of trigger dynamics in ESD protection devices under very fast TLP stress. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1557-1561 [Journal ] Abdellatif Firiti , D. Faujour , G. Haller , J. M. Moragues , V. Goubier , Philippe Perdu , Felix Beaudoin , D. Lewis Short defect characterization based on TCR parameter extraction. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1563-1568 [Journal ] M. S. B. Sowariraj , Theo Smedes , Cora Salm , Ton J. Mouthaan , Fred G. Kuper Role of package parasitics and substrate resistance on the Charged Device Model (CDM) failure levels -An explanation and die protection strategy. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1569-1575 [Journal ] T. Beauchêne , D. Trémouilles , D. Lewis , Philippe Perdu , P. Fouillat Characterization of ESD induced defects using Photovoltaic Laser Stimulation (PLS). [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1577-1582 [Journal ] Wen-Yu Lo , Ming-Dou Ker Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1583-1588 [Journal ] Gaudenzio Meneghesso , N. Novembre , Enrico Zanoni , L. Sponton , L. Cerati , G. Croce Optimization of ESD protection structures suitable for BCD6 smart power technology. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1589-1594 [Journal ] J. C. H. Phang , D. S. H. Chan , V. K. S. Ong , S. Kolachina , J. M. Chin , M. Palaniappan , G. Gilfeather , Y. X. Seah Single contact beam induced current phenomenon for microelectronic failure analysis. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1595-1602 [Journal ] Franco Stellari , Peilin Song , Moyra K. McManus , Alan J. Weger , Robert Gauthier , Kiran V. Chatty , Mujahid Muhammad , Pia Sanda , Philip Wu , Steve Wilson Latchup Analysis Using Emission Microscopy. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1603-1608 [Journal ] Stefan Dilhaire , M. Amine Salhi , Stéphane Grauby , Wilfrid Claeys Laser Seebeck Effect Imaging (SEI) and Peltier Effect Imaging (PEI): complementary investigation methods. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1609-1613 [Journal ] F. Darracq , H. Lapuyade , N. Buard , P. Fouillat , R. Dufayel , T. Carriere Low-cost backside laser test method to pre-characterize the COTS IC's sensitivity to Single Event Effects. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1615-1619 [Journal ] P. LeCoupanec , William K. Lo , Keneth R. Wilsher An ultra-low dark-count and jitter, superconducting, single-photon detector for emission timing analysis of integrated circuits. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1621-1626 [Journal ] Katsuyoshi Miura , Tomoyuki Kobatake , Koji Nakamae , Hiromu Fujioka A low energy FIB processing, repair, and test system. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1627-1631 [Journal ] F. Seifert , R. Weber , W. Mertin , E. Kubalek A new technique for contactless current contrast imaging of high frequency signals. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1633-1638 [Journal ] M. Remmach , Romain Desplats , Felix Beaudoin , E. Frances , Philippe Perdu , D. Lewis Time Resolved Photoemission (PICA) - From the Physics to Practical Considerations. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1639-1644 [Journal ] Hervé Deslandes , T. R. Lundquist Limitations to photon-emission microscopy when applied to "hot" devices. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1645-1650 [Journal ] Maria Stangoni , Mauro Ciappa , Wolfgang Fichtner A New Procedure to Define the Zero-Field Condition and to Delineate pn-Junctions in Silicon Devices by Scanning Capacitance Microscopy. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1651-1656 [Journal ] L. A. Knauss , A. Orozco , S. I. Woods , A. B. Cawthorne Advances in scanning SQUID microscopy for die-level and package-level fault isolation. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1657-1662 [Journal ] Romain Desplats , A. Eral , Felix Beaudoin , Philippe Perdu , Alan J. Weger , Moyra K. McManus , Peilin Song , Franco Stellari Faster IC Analysis with PICA Spatial Temporal Photon Correlation and CAD Autochanneling. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1663-1668 [Journal ] Alberto Tosi , Franco Stellari , F. Zappa , S. Cova Backside Flip-Chip testing by means of high-bandwidth luminescence detection. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1669-1674 [Journal ] B. Simmnacher , R. Weiland , J. Höhne , F. v. Feilitzsch , C. Hollerith Semiconductor material analysis based on microcalorimeter EDS. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1675-1680 [Journal ] Felix Beaudoin , Romain Desplats , Philippe Perdu , Abdellatif Firiti , G. Haller , V. Pouget , D. Lewis From Static Thermal and Photoelectric Laser Stimulation (TLS/PLS) to Dynamic Laser Testing. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1681-1686 [Journal ] Jon C. Lee , J. H. Chuang A Novel Application of C-AFM: Deep Sub-micron Single Probing for IC Failure Analysis. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1687-1692 [Journal ] Paul-Henri Albarède , S. Lavagne , C. Grosjean Strain investigation around shallow trench isolations : a LACBED Study. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1693-1698 [Journal ] N. Lucarelli , M. Cavone , M. Muschitiello , D. Centrone , F. Corsi Thermally Induced Voltage Alteration (TIVA) applied to ESD induced failures. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1699-1704 [Journal ] S. L. Delage , C. Dua Wide band gap semiconductor reliability : Status and trends. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1705-1712 [Journal ] A. Curutchet , N. Malbert , N. Labat , A. Touboul , C. Gaquière , A. Minko , M. Uren Low frequency drain noise comparison of AlGaN/GaN HEMT's grown on silicon, SiC and sapphire substrates. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1713-1718 [Journal ] J. Kuchenbecker , M. Borgarino , M. Zeuner , U. König , R. Plana , Fausto Fantini High Electric Field Induced Degradation of the DC Characteristics in Si/SiGe HEMT's. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1719-1723 [Journal ] J. C. Martin , C. Maneux , N. Labat , A. Touboul , M. Riet , S. Blayac , M. Kahn , J. Godin 1/f noise analysis of InP/InGaAs DHBTs submitted to bias and thermal stresses. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1725-1730 [Journal ] M. Belhaj , C. Maneux , N. Labat , A. Touboul , P. Bove High current effects in InP/GaAsSb/InP DHBT: Physical mechanisms and parasitic effects. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1731-1736 [Journal ] Gaudenzio Meneghesso , S. Levada , Enrico Zanoni , G. Scamarcio , G. Mura , Simona Podda , Massimo Vanzi , S. Du , I. Eliashevich Reliability of visible GaN LEDs in plastic package. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1737-1742 [Journal ] L. Mendizabal , J. L. Verneuil , L. Béchou , C. Aupetit-Berthelemot , Y. Deshayes , F. Verdier , J. M. Dumas , Y. Danto , D. Laffitte , J. L. Goudard Impact of 1.55 mum laser diode degradation laws on fibre optic system performances using a system simulator. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1743-1749 [Journal ] J. Van de Casteele , D. Laffitte , G. Gelly , C. Starck , M. Bettiati High reliability level demonstrated on 980nm laser diode. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1751-1754 [Journal ] Kevin Sanchez , Romain Desplats , G. Perez , V. Pichetto , Felix Beaudoin , Philippe Perdu Solar Cell Analysis with Light Emission and OBIC Techniques. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1755-1760 [Journal ] C. Gautier , J. Périnet , E. Nissou , D. Laffitte New method of qualification applied to optical amplifier with electronics. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1761-1766 [Journal ] J. L. Goudard , X. Boddaert , J. Périnet , D. Laffitte Reliability of optoelectronics components: towards new qualification practices. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1767-1769 [Journal ] G. Mura , Massimo Vanzi , Maria Stangoni , Mauro Ciappa , Wolfgang Fichtner On the behaviour of the selective iodine-based gold etch for the failure analysis of aged optoelectronic devices. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1771-1776 [Journal ] G. Q. Zhang The challenges of virtual prototyping and qualification for future microelectronics. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1777-1783 [Journal ] P. Soussan , G. Lekens , R. Dreesen , Ward De Ceuninck , E. Beyne Advantage of In-situ over Ex-situ techniques as reliability tool: Aging kinetics of Imec's MCM-D discrete passives devices. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1785-1790 [Journal ] P. Tropea , A. Mellal , J. Botsis Deformation and damage of a solder-copper joint. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1791-1796 [Journal ] A. B. Horsfall , J. M. M. dos Santos , S. M. Soare , N. G. Wright , A. G. O'Neill , S. J. Bull , A. J. Walton , A. M. Gundlach , J. T. M. Stevenson Direct measurement of residual stress in integrated circuit interconnect features. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1797-1801 [Journal ] G. Andriamonje , V. Pouget , Y. Ousten , D. Lewis , Y. Danto , J. M. Rampnoux , Y. Ezzahri , Stefan Dilhaire , Stéphane Grauby , Wilfrid Claeys Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1803-1807 [Journal ] O. Crépel , Romain Desplats , Y. Bouttement , Philippe Perdu , C. Goupil , Ph. Descamps , Felix Beaudoin , L. Marina Magnetic emission mapping for passive integrated components characterisation. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1809-1814 [Journal ] P. Rajamand , R. Tilgner , R. Schmidt , J. Baumann , P. Klofac , M. Rothenfusser Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1815-1820 [Journal ] David Dalleau , Kirsten Weide-Zaage , Yves Danto Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1821-1826 [Journal ] M. Krüger , J. Krinke , K. Ritter , B. Zierle , M. Weber Laser-assisted decapsulation of plastic-encapsulated devices. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1827-1831 [Journal ] G. Lefranc , B. Weiss , C. Klos , J. Dick , G. Khatibi , H. Berg Aluminum bond-wire properties after 1 billion mechanical cycles. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1833-1838 [Journal ] W. Kanert , H. Dettmer , B. Plikat , N. Seliger Reliability aspects of semiconductor devices in high temperature applications. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1839-1846 [Journal ] F. Velardi , F. Iannuzzo , G. Busatto , J. Wyss , A. Sanseverino , A. Candelori , G. Currò , A. Cascio , F. Frisina Reliability of Medium Blocking Voltage Power VDMOSFET in Radiation Environment. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1847-1851 [Journal ] Alexandrine Guédon , Eric Woirgard , Christian Zardini , Guillaume Simon Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1853-1858 [Journal ] E. Hornung , U. Scheuermann Reliability of low current electrical spring contacts in power modules. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1859-1864 [Journal ] Yannick Rey-Tauriac , O. de Sagazan , M. Taurin , Olivier Bonnaud Robustness improvement of VDMOS transistors in Bipolar/CMOS/DMOS technology. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1865-1869 [Journal ] G. Coquery , G. Lefranc , T. Licht , R. Lallemand , N. Seliger , H. Berg High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1871-1876 [Journal ] Alessandro Castellazzi , V. Kartal , R. Kraus , N. Seliger , M. Honsberg-Riedl , Doris Schmitt-Landsiedel Hot-Spot Meaurements and Analysis of Electro-Thermal Effects in Low-Voltage Power-MOSFET's. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1877-1882 [Journal ] J. Vobecký , P. Hazdra Advanced Local Lifetime Control for Higher Reliability of Power Devices. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1883-1888 [Journal ] T. Ayalew , Andreas Gehring , J. M. Park , Tibor Grasser , Siegfried Selberherr Improving SiC lateral DMOSFET reliability under high field stress. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1889-1894 [Journal ] A. Icaza Deckelmann , Gerhard K. M. Wachutka , F. Hirler , J. Krumrey , R. Henninger Avalanche breakdown capability of Power DMOS Transistors and the Wunsch-Bell relation. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1895-1900 [Journal ] S. Azzopardi , E. Woirgard , J.-M. Vinassa , O. Briat , C. Zardini IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power? [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1901-1906 [Journal ] G. Busatto , F. Iannuzzo , F. Velardi , M. Valentino , G. P. Pepe Non-Destructive Detection of Current Distribution in Power Modules based on Pulsed Magnetic Measurement. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1907-1912 [Journal ] K. I. Nuttall , O. Buiu , V. V. N. Obreja Surface leakage current related failure of power silicon devices operated at high junction temperature. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1913-1918 [Journal ] L. Buchaillot Feedback of MEMS reliability study on the design stage: a step toward Reliability Aided Design (RAD). [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1919-1928 [Journal ] Cezary Sydlo , K. Mutamba , L. Divac Krnic , Bastian Mottet , Hans L. Hartnagel Reliability studies on integrated GaAs power-sensor structures using pulsed electrical stress. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1929-1933 [Journal ] I. Boyer Heard , R. Coquillé , D. Rivière , P.-Y. Klimonda Characterization and reliability of a switch matrix based on MOEMS technology. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1935-1937 [Journal ] A. Tetelin , C. Pellet , J.-Y. Delétage , B. Carbonne , Y. Danto Moisture diffusion in BCB resins used for MEMS packaging. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1939-1944 [Journal ] S. Muratet , J. Y. Fourniols , G. Soto-Romero , A. Endemaño , A. Marty , M. Desmulliez MEMS reliability modelling methodology: application to wobble micromotor failure analysis. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1945-1949 [Journal ] Guillaume Marinier , Stefan Dilhaire , Luis David Patiño Lopez , Mohamed Benzohra Determination of passive SiO2 -Au microstructure resonant frequencies. [Citation Graph (0, 0)][DBLP ] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1951-1955 [Journal ]