Journals in DBLP

Microelectronics Reliability
2003, volume: 43, number: 7

1. Horst A. Gieser
   On-chip electrostatic discharge ESD. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:7, pp:985-986 [Journal]
   
2. Steven S. Poon, Timothy J. Maloney
   New considerations for MOSFET power clamps. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:7, pp:987-991 [Journal]
   
3. Markus P. J. Mergens, Christian C. Russ, Koen G. Verhaege, John Armer, Phillip Jozwiak, Russ Mohn
   High holding current SCRs (HHI-SCR) for ESD protection and latch-up immune IC operation. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:7, pp:993-1000 [Journal]
   
4. M. Streibl, K. Esmark, A. Sieck, Wolfgang Stadler, M. Wendel, J. Szatkowski, Harald Gossner
   Harnessing the base-pushout effect for ESD protection in bipolar and BiCMOS technologies. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:7, pp:1001-1010 [Journal]
   
5. Vesselin K. Vassilev, S. Jenei, Guido Groeseneken, R. Venegas, S. Thijs, V. De Heyn, M. Natarajan Iyer, Michiel Steyaert, H. E. Maes
   High frequency characterization and modelling of the parasitic RC performance of two terminal ESD CMOS protection devices. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:7, pp:1011-1020 [Journal]
   
6. Sopan Joshi, Elyse Rosenbaum
   Simulator-independent compact modeling of vertical npn transistors for ESD and RF circuit simulation. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:7, pp:1021-1027 [Journal]
   
7. Boris Lisenker
   Process influence on product CDM ESD performance. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:7, pp:1029-1037 [Journal]
   
8. Sherry Suat Cheng Khoo, Pee Ya Tan, Steven H. Voldman
   Microanalysis and electromigration reliability performance of high current transmission line pulse (TLP) stressed copper interconnects. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:7, pp:1039-1045 [Journal]
   
9. Ingrid De Wolf
   MEMS reliability. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:7, pp:1047-1048 [Journal]
   
10. W. Merlijn van Spengen
    MEMS reliability from a failure mechanisms perspective. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1049-1060 [Journal]
    
11. X. Lafontan, F. Pressecq, Felix Beaudoin, S. Rigo, M. Dardalhon, J.-L. Roux, P. Schmitt, J. Kuchenbecker, B. Baradat, D. Lellouchi
    The advent of MEMS in space. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1061-1083 [Journal]
    
12. Roland Müller-Fiedler, Volker Knoblauch
    Reliability aspects of microsensors and micromechatronic actuators for automotive applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1085-1097 [Journal]
    
13. A. Dommann, A. Enzler, N. Onda
    Advanced X-ray analysis techniques to investigate aging of micromachined silicon actuators for space application. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1099-1103 [Journal]
    
14. X. Q. Shi, Z. P. Wang, J. P. Pickering
    A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1105-1115 [Journal]
    
15. Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong
    Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1117-1123 [Journal]
    
16. Y. Deshayes, L. Béchou, J.-Y. Delétage, F. Verdier, Y. Danto, D. Laffitte, J. L. Goudard
    Three-dimensional FEM simulations of thermomechanical stresses in 1.55 mum Laser modules. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1125-1136 [Journal]
    
17. J.-Y. Delétage, F. J.-M. Verdier, B. Plano, Y. Deshayes, L. Béchou, Y. Danto
    Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1137-1144 [Journal]
    
18. M. Jagadesh Kumar, C. Linga Reddy
    2D-simulation and analysis of lateral SiC N-emitter SiGe P-base Schottky metal-collector (NPM) HBT on SOI. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1145-1149 [Journal]
    
19. Xiang-Ti Meng, Ai-Guo Kang, Ji-Hong Li, Hai-Yun Zhang, Shi-jie Yu, Zheng You
    Effects of electron and gamma-ray irradiation on CMOS analog image sensors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1151-1155 [Journal]
    
20. Timo Liukkonen, Aulis Tuominen
    Decreasing variation in paste printing using statistical process control. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1157-1161 [Journal]
    
21. Haifeng Zhou, Zhenghui Lin, Wei Cao
    ILP method for memory mapping in high-level synthesis. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1163-1167 [Journal]
    
22. Thomas D. Moore, John L. Jarvis
    Erratum to "A simple and fundamental design rule for resisting delamination in bimaterial structures" [Microelectronics Reliability 2003;43: 487-494]. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1169- [Journal]
    
23. Mile K. Stojcev
    Rohit Kapur, CTL for Test Information of Digital ICs Hardcover. Kluwer Academic Publisher, Boston, 2003. pp 173, plus XI, ISBN 1-4020-7293-7. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1171-1172 [Journal]