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Journals in DBLP

Microelectronics Reliability
2003, volume: 43, number: 3

  1. Andrzej Dziedzic
    Special Section on IMAPS-Europe 2002. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:343- [Journal]
  2. Jürgen Wilde, Yuqing Lai
    Design optimization of an eddy current sensor using the finite-elements method. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:345-349 [Journal]
  3. Arun Chandrasekhar, Steven Brebels, Serguei Stoukatch, Eric Beyne, Walter De Raedt, Bart Nauwelaers
    The influence of packaging materials on RF performance. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:351-357 [Journal]
  4. Jürgen Schulz-Harder
    Advantages and new development of direct bonded copper substrates. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:359-365 [Journal]
  5. Guo Lihui, Yu Mingbin, Foo Pang Dow
    RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:367-370 [Journal]
  6. J. Müller, J. Klein, J. Rayho
    In-process verification of MLC substrates. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:371-375 [Journal]
  7. Andrzej Dziedzic, Lars Rebenklau, Leszek J. Golonka, Klaus-Jürgen Wolter
    Fodel microresistors-processing and basic electrical properties. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:377-383 [Journal]
  8. Kinam Kim, Yoon J. Song
    Integration technology for ferroelectric memory devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:385-398 [Journal]
  9. Mansun Chan, Xuemei Xi, Jin He, Kanyu M. Cao, Mohan V. Dunga, Ali M. Niknejad, Ping K. Ko, Chenming Hu
    Practical compact modeling approaches and options for sub-0.1 mum CMOS technologies. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:399-404 [Journal]
  10. Handoko Linewih, Sima Dimitrijev, Kuan Yew Cheong
    Channel-carrier mobility parameters for 4H SiC MOSFETs. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:405-411 [Journal]
  11. S. Hidalgo, D. Flores, I. Obieta, I. Mazarredo
    Passivation and packaging of positive bevelled edge termination and related electrical stability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:413-420 [Journal]
  12. Yang-Hua Chang, Chen-Chun Chang-Chiang, Yueh-Cheng Lee, Chi-Chung Liu
    Design of multi-finger HBTs with a thermal-electrical model. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:421-426 [Journal]
  13. V. A. Vashchenko, A. Concannon, M. ter Beek, P. Hopper
    Quasi-3D simulation approach for comparative evaluation of triggering ESD protection structures. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:427-437 [Journal]
  14. T. Beauchêne, D. Lewis, Felix Beaudoin, V. Pouget, Romain Desplats, P. Fouillat, Philippe Perdu, M. Bafleur, D. Trémouilles
    Thermal laser stimulation and NB-OBIC techniques applied to ESD defect localization. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:439-444 [Journal]
  15. Petteri Palm, Jarmo Määttänen, Yannick De Maquillé, Alain Picault, Jan Vanfleteren, Björn Vandecasteele
    Comparison of different flex materials in high density flip chip on flex applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:445-451 [Journal]
  16. R. K. Shiue, L. W. Tsay, C. L. Lin, J. L. Ou
    The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:453-463 [Journal]
  17. Yuko Sawada, Kozo Harada, Hirofumi Fujioka
    Study of package warp behavior for high-performance flip-chip BGA. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:465-471 [Journal]
  18. Hirokazu Ezawa, Masaharu Seto, Masahiro Miyata, Hiroshi Tazawa
    Polymer film deposition with fine pitch openings by stencil printing. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:473-479 [Journal]
  19. C. W. Tan, Y. C. Chan, N. H. Yeung
    Behaviour of anisotropic conductive joints under mechanical loading. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:481-486 [Journal]
  20. Thomas D. Moore, John L. Jarvis
    A simple and fundamental design rule for resisting delamination in bimaterial structures. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:487-494 [Journal]
  21. W. L. Pearn, Ming-Hung Shu
    An algorithm for calculating the lower confidence bounds of CPU and CPL with application to low-drop-out linear regulators. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:495-502 [Journal]
  22. Takeshi Yanagisawa, Takeshi Kojima
    The stability of the CuInSe2 solar mini-module I-V characteristics under continuous and light/dark irradiation cycle tests. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:503-507 [Journal]
  23. G. Golan, A. Axelevitch, B. Sigalov, B. Gorenstein
    Integrated thin film heater-thermocouple systems. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:509-512 [Journal]
  24. Mile K. Stojcev
    Memory Design Techniques for Low Energy Embedded Systems; Alberto Macii, Luca Benini, Massimo Poncino. Kluwer Academic Publishers, Boston, USA, 2002. Hard cover, pp 144 plus XI, ISBN 0-7923-7690-0. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:513- [Journal]
  25. Mile K. Stojcev
    A designer's guide to built-in self-test; Charles E. Stround. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp 319, plus XVI, ISBN 1-4020-7050-0. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:514-515 [Journal]
  26. Mile K. Stojcev
    Semiconductor Memories: Technologies, Testing and Reliability; Ashok K. Sharma. IEEE Press and Wiley Interscience, New York, 1997. Hardcover, pp 462, plus XII, ISBN 0-7803-1000-4. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:515- [Journal]
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