Journals in DBLP

Microelectronics Reliability
2003, volume: 43, number: 12

1. Clemens J. M. Lasance
   Thermally driven reliability issues in microelectronic systems: status-quo and challenges. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:1969-1974 [Journal]
   
2. Glenn A. Rinne
   Issues in accelerated electromigration of solder bumps. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:1975-1980 [Journal]
   
3. Hongguo Zhang, Pant Gurang, Nihdi Sigh, Quvdo Manuel, Robert Wallace, Bruce Gnade, Kevin Stokes
   The effect of small-signal AC voltages on C-V characterization and parameter extraction of SiO₂ thin films. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:1981-1985 [Journal]
   
4. X. A. Cao, P. M. Sandvik, S. F. LeBoeuf, S. D. Arthur
   Defect generation in InGaN/GaN light-emitting diodes under forward and reverse electrical stresses. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:1987-1991 [Journal]
   
5. Y. S. Roh, A. Asiz, W. P. Zhang, Y. Xi
   Experimental study and theoretical prediction of aging induced frequency shift of crystal resonators and oscillators. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:1993-2000 [Journal]
   
6. Han-Chang Tsai
   Reliable study of digital IC circuits with margin voltage among variable DC power supply, electromagnetic interference and conducting wire antenna. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:2001-2009 [Journal]
   
7. W. Dauksher, W. S. Burton
   An examination of the applicability of the DNP metric on first level reliability assessments in underfilled electronic packages. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:2011-2020 [Journal]
   
8. Hua Ye, Douglas C. Hopkins, Cemal Basaran
   Measurement of high electrical current density effects in solder joints. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:2021-2029 [Journal]
   
9. M. N. Islam, Y. C. Chan, A. Sharif, M. O. Alam
   Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:2031-2037 [Journal]
   
10. Y. F. Yao, T. Y. Lin, K. H. Chua
    Improving the deflection of wire bonds in stacked chip scale package (CSP). [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:12, pp:2039-2045 [Journal]
    
11. Insu Jeon, Qwanho Chung
    The study on failure mechanisms of bond pad metal peeling: Part A--Experimental investigation. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:12, pp:2047-2054 [Journal]
    
12. Insu Jeon
    The study on failure mechanisms of bond pad metal peeling: Part B--Numerical analysis. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:12, pp:2055-2064 [Journal]
    
13. Kazuto Nishida, Kazumichi Shimizu, Michiro Yoshino, Hideo Koguchi, Nipon Taweejun
    Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology--double-sided CSP and single-sided CSP. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:12, pp:2065-2075 [Journal]
    
14. Mohammad Yunus, K. Srihari, J. M. Pitarresi, Anthony Primavera
    Effect of voids on the reliability of BGA/CSP solder joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:12, pp:2077-2086 [Journal]
    
15. E. H. Wong, Ranjan Rajoo
    Moisture absorption and diffusion characterisation of packaging materials--advanced treatment. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:12, pp:2087-2096 [Journal]