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Journals in DBLP

Microelectronics Reliability
2003, volume: 43, number: 5

  1. Mark Zwolinski, M. S. Gaur
    Integrating testability with design space exploration. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:685-693 [Journal]
  2. Reza Ghaffarian
    Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:695-706 [Journal]
  3. Ru Huang, Jinyan Wang, Jin He, Min Yu, Xing Zhang, Yangyuan Wang
    Hot carrier degradation behavior in SOI dynamic-threshold-voltage nMOSFET's (n-DTMOSFET) measured by gated-diode configuration. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:707-711 [Journal]
  4. Summer F. C. Tseng, Wei-Ting Kary Chien, Bing-Chu Cai
    Improvement of poly-silicon hole induced gate oxide failure by silicon rich oxidation. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:713-724 [Journal]
  5. Xiaofang Gao, Juin J. Liou, Joe Bernier, Gregg Croft, Waisum Wong, Satya Vishwanathan
    Optimization of on-chip ESD protection structures for minimal parasitic capacitance. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:725-733 [Journal]
  6. Chihoon Lee, Donggun Park, Hyeong Joon Kim, Wonshik Lee
    Electrical reliability of highly reliable 256M-bit mobile DRAM with top-edge round STI and dual gate oxide. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:735-739 [Journal]
  7. Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong
    Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:741-749 [Journal]
  8. Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga
    Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:751-756 [Journal]
  9. K. S. Kim, C. H. Yu, N. H. Kim, N. K. Kim, H. J. Chang, E. G. Chang
    Isothermal aging characteristics of Sn-Pb micro solder bumps. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:757-763 [Journal]
  10. W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, Kerm Sin Chian, Sung Yi
    Prediction and verification of process induced warpage of electronic packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:765-774 [Journal]
  11. Ping Zhao, Michael G. Pecht
    Field failure due to creep corrosion on components with palladium pre-plated leadframes. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:775-783 [Journal]
  12. Z. Zhao
    Thermal design of a broadband communication system with detailed modeling of TBGA packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:785-793 [Journal]
  13. Vencislav Valchev, Alex Van den Bossche
    Accurate natural convection modelling for magnetic components. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:795-802 [Journal]
  14. T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu
    Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:803-809 [Journal]
  15. T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua
    Development of the green plastic encapsulation for high density wirebonded leaded packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:811-817 [Journal]
  16. Mile K. Stojcev
    High Performance Memory Testing: Design Principles, Fault Modeling and Self-Test; R. Dean Adams, Kluwer Academic Publishers, Boston, 2003, Hardcover, pp 247, plus XIII, ISBN 1-4020-7255-4. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:819- [Journal]
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