Journals in DBLP

Microelectronics Reliability
2003, volume: 43, number: 1

1. Harry A. Schafft, Linda M. Head, Jason Gill, Timothy D. Sullivan
   Early reliability assessment by using deep censoring. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:1, pp:1-16 [Journal]
   
2. Michael W. Ruprecht, Guenther Benstetter, Doug Hunt
   A review of ULSI failure analysis techniques for DRAMs. Part II: Defect isolation and visualization. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:1, pp:17-41 [Journal]
   
3. C.-T. Wu, A. Mieckowski, R. S. Ridley, G. Dolny, T. Grebs, J. Linn, J. Ruzyllo
   Effect of nitridation on the reliability of thick gate oxides. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:1, pp:43-47 [Journal]
   
4. Emil V. Jelenkovic, K. Y. Tong, W. Y. Cheung, S. P. Wong
   Degradation of RuO₂ thin films in hydrogen atmosphere at temperatures between 150 and 250 degreeC. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:1, pp:49-55 [Journal]
   
5. N. A. Hastas, C. A. Dimitriadis, J. Brini, G. Kamarinos, V. K. Gueorguiev, S. Kaschieva
   Effects of gamma-ray irradiation on polycrystalline silicon thin-film transistors. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:1, pp:57-60 [Journal]
   
6. V. A. Vashchenko, A. Concannon, M. ter Beek, P. Hopper
   LVTSCR structures for latch-up free ESD protection of BiCMOS RF circuits. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:1, pp:61-69 [Journal]
   
7. D. Trémouilles, G. Bertrand, M. Bafleur, Felix Beaudoin, Philippe Perdu, N. Guitard, L. Lescouzères
   TCAD and SPICE modeling help solve ESD protection issues in analog CMOS technology. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:1, pp:71-79 [Journal]
   
8. P. Cova, Roberto Menozzi, M. Portesine
   Power p-i-n diodes for snubberless application: H⁺ irradiation for soft and reliable reverse recovery. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:1, pp:81-87 [Journal]
   
9. S. Forster, T. Lequeu, R. Jérisian
   Degradation mechanism of power devices under di/dt thermal shocks: turn-on of a TRIAC in Q3. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:1, pp:89-98 [Journal]
   
10. G. Romo, T. Smy, D. Walkey, B. Reid
    Modeling facet heating in ridge lasers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:1, pp:99-110 [Journal]
    
11. A. Cazarré, F. Lépinois, A. Marty, S. Pinel, J. Tasselli, J. P. Bailbé, J. R. Morante, F. Murray
    Electrical qualification of new ultrathin integration techniques. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:1, pp:111-115 [Journal]
    
12. M. Karilahti
    Neural net analysis of integrated circuit yield dependence on CMOS process control parameters. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:1, pp:117-121 [Journal]
    
13. Kuo-Ming Chen, Kuo-Ning Chiang
    Impact of probing procedure on flip chip reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:1, pp:123-130 [Journal]
    
14. Chi-Hui Chien, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, Yii-Der Wu
    Influences of the moisture absorption on PBGA package's warpage during IR reflow process. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:1, pp:131-139 [Journal]
    
15. Harry K. Charles Jr., K. J. Mach, S. J. Lehtonen, Arthur S. Francomacaro, J. S. DeBoy, R. L. Edwards
    Wirebonding at higher ultrasonic frequencies: reliability and process implications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:1, pp:141-153 [Journal]
    
16. Thomas D. Moore, John L. Jarvis
    Thermomechanical deformation of a bimaterial plate--as applied to laminate IC assemblies. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:1, pp:155-162 [Journal]
    
17. David C. T. Or, P. T. Lai, J. K. O. Sin, Paul C. K. Kwok, J. P. Xu
    Enhanced reliability for low-temperature gate dielectric of MOS devices by N₂O or NO plasma nitridation. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:1, pp:163-166 [Journal]
    
18. Roland Sorge
    Implant dose monitoring by MOS C-V measurement. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:1, pp:167-171 [Journal]
    
19. T. Beauchêne, D. Lewis, Felix Beaudoin, V. Pouget, Philippe Perdu, P. Fouillat, Y. Danto
    A physical approach on SCOBIC investigation in VLSI. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:1, pp:173-177 [Journal]