Journals in DBLP

Microelectronics Reliability
2004, volume: 44, number: 2

1. Young-Hee Kim, Jack C. Lee
   Reliability characteristics of high-k dielectrics. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2004, v:44, n:2, pp:183-193 [Journal]
   
2. Christine S. Hau-Riege
   An introduction to Cu electromigration. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2004, v:44, n:2, pp:195-205 [Journal]
   
3. Yi-Mu Lee, Yider Wu, Gerald Lucovsky
   Breakdown and reliability of p-MOS devices with stacked RPECVD oxide/nitride gate dielectric under constant voltage stress. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2004, v:44, n:2, pp:207-212 [Journal]
   
4. Chih-Yao Huang, Wei-Fang Chen, Song-Yu Chuan, Fu-Chien Chiu, Jeng-Chou Tseng, I-Cheng Lin, Chuan-Jane Chao, Len-Yi Leu, Ming-Dou Ker
   Design optimization of ESD protection and latchup prevention for a serial I/O IC. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2004, v:44, n:2, pp:213-221 [Journal]
   
5. A. Bouhdada, R. Marrakh, F. Vigué, J.-P. Faurie
   Modeling of the spectral response of PIN photodetectors Impact of exposed zone thickness, surface recombination velocity and trap concentration. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2004, v:44, n:2, pp:223-228 [Journal]
   
6. Takeshi Yanagisawa, Takeshi Kojima, Tadamasa Koyanagi
   Behavior of Cu(In, Ga)Se₂ solar cells under light/damp heat over time. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2004, v:44, n:2, pp:229-235 [Journal]
   
7. Hyun Ho Kim, Byeong Kwon Ju, Yun Hi Lee, Si Hyung Lee, Jeon Kook Lee, Soo Won Kim
   Fabrication of suspended thin film resonator for application of RF bandpass filter. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2004, v:44, n:2, pp:237-243 [Journal]
   
8. Simone Lee, Ramesh Ramadoss, Michael Buck, V. M. Bright, K. C. Gupta, Y. C. Lee
   Reliability testing of flexible printed circuit-based RF MEMS capacitive switches. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2004, v:44, n:2, pp:245-250 [Journal]
   
9. Yi Tao, Ajay P. Malshe, William D. Brown
   Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2004, v:44, n:2, pp:251-258 [Journal]
   
10. Jason Y. L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh, Daniel Vanderstraeten
    Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:259-267 [Journal]
    
11. Ikuo Shohji, Hideo Mori, Yasumitsu Orii
    Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:269-274 [Journal]
    
12. Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie
    Materials characterization of the effect of mechanical bending on area array package interconnects. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:275-285 [Journal]
    
13. Cristina Lopez, Liang Chai, Aziz Shaikh, Vern Stygar
    Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:287-294 [Journal]
    
14. Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu
    Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:295-302 [Journal]
    
15. Katsuhito Yoshida, Hideaki Morigami
    Thermal properties of diamond/copper composite material. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:303-308 [Journal]
    
16. Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl
    Long time reliability study of soldered flip chips on flexible substrates. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:309-314 [Journal]
    
17. Seok Hwan Moon, Gunn Hwang, Sang Choon Ko, Youn Tae Kim
    Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:315-321 [Journal]
    
18. Esther Wai Ching Yau, Jing Feng Gong, Philip Chan
    Al surface morphology effect on flip-chip solder bump shear strength. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:323-331 [Journal]
    
19. Arun Ramakrishnan, Michael G. Pecht
    Load characterization during transportation. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:333-338 [Journal]
    
20. Juan A. Carrasco, Víctor Suñé
    Combinatorial methods for the evaluation of yield and operational reliability of fault-tolerant systems-on-chip. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:339-350 [Journal]
    
21. W. Dabrowski, P. Grybos, T. Fiutowski
    Design for good matching in multichannel low-noise amplifier for recording neuronal signals in modern neuroscience experiments. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:351-361 [Journal]
    
22. Mile K. Stojcev
    Interconnecting and Computing over Satellite Networks; Yongguang Zhang (Ed.). Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 262, plus XXII, ISBN 1-4020-7424-7. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:363-364 [Journal]