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Microelectronics Reliability
2004, volume: 44, number: 4

  1. Jorge Salcedo-Suñer, Charvaka Duvvury, Roger Cline, Alfonso Cadena-Hernandez
    Latchup in voltage tolerant circuits: a new phenomenon. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:549-562 [Journal]
  2. J. A. Felix, J. R. Schwank, D. M. Fleetwood, M. R. Shaneyfelt, E. P. Gusev
    Effects of radiation and charge trapping on the reliability of high-kappa gate dielectrics. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:563-575 [Journal]
  3. P. T. Lai, J. P. Xu, H. P. Wu, C. L. Chan
    Interfacial properties and reliability of SiO2 grown on 6H-SiC in dry O2 plus trichloroethylene. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:577-580 [Journal]
  4. Guo Lihui, Zhang Yibin, Su Yong Jie Jeffrey
    Integrating thick copper/Black DiamondTM layer in CMOS interconnect process for RF passive components. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:581-585 [Journal]
  5. Teija Uusluoto, Paavo Jalonen, Harri Laaksonen, Aulis Tuominen
    Metallization of microvias by sputter-deposition. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:587-593 [Journal]
  6. N. H. Yeung, Victor Lau, Y. C. Chan
    Bias-HAST on tape ball grid array (TBGA) test pattern. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:595-602 [Journal]
  7. T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma
    The impact of moisture in mold compound preforms on the warpage of PBGA packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:603-609 [Journal]
  8. Xiaowu Zhang, E. H. Wong, Charles Lee, Tai-Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath
    Thermo-mechanical finite element analysis in a multichip build up substrate based package design. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:611-619 [Journal]
  9. Kyoungsoon Cho, Insu Jeon
    Numerical analysis of the warpage problem in TSOP. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:621-626 [Journal]
  10. Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang
    Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:627-638 [Journal]
  11. A. Seppälä, Eero Ristolainen
    Study of adhesive flip chip bonding process and failure mechanisms of ACA joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:639-648 [Journal]
  12. Juan Santana, Magali Estrada, Ofelia Martinez
    Editorial. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:649- [Journal]
  13. I. León, R. Amador, K. Kohlhof
    Evaluation of MUMPS polysilicon structures for thermal flow sensors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:651-655 [Journal]
  14. Fernando da Rocha Paixão Cortes, Eric E. Fabris, Sergio Bampi
    Analysis and design of amplifiers and comparators in CMOS 0.35 mum technology. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:657-664 [Journal]
  15. Alessandro Girardi, Sergio Bampi
    AC analysis of an inverter amplifier using minimum-length trapezoidal association of transistors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:665-671 [Journal]
  16. José Ernesto Rayas-Sánchez
    A frequency-domain approach to interconnect crosstalk simulation and minimization. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:673-681 [Journal]
  17. J. Louzao, S. Paz, D. Tejera, G. Bellora, Guillermo Langwagen
    Architectural design of a programmable cell for the implementation of a filter bank on FPGA. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:683-695 [Journal]
  18. Luciano Volcan Agostini, Ivan Saraiva Silva, Sergio Bampi
    Parallel color space converters for JPEG image compression. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:697-703 [Journal]
  19. Gang Qu, Miodrag Potkonjak, Mile K. Stojcev
    Book review: Intellectual property protection in VLSI designs: Theory and practice, Hardcover, pp 183, plus XIX, Kluwer Academic Publishers, Boston, 2003, ISBN 1-4020-7320-8. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:705-706 [Journal]
  20. Mile K. Stojcev
    Power estimation and optimization for VLIW-based embedded systems; Vittorio Zaccaria, Mariagiovanna Sami, Donatella Sciuto, Cristina Silvano. Hardcover, pp 203, plus XXIV, Kluwer Academic Publishers, Boston, 2003. ISBN 1-4020-7377-1. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:707-708 [Journal]
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