Journals in DBLP
Joachim N. Burghartz Review of add-on process modules for high-frequency silicon technology. [Citation Graph (0, 0)][DBLP ] Journal ] John S. Suehle , B. Zhu , Y. Chen , Joseph B. Bernstein Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides. [Citation Graph (0, 0)][DBLP ] Journal ] Bonnie E. Weir , Che-Choi Leung , Paul J. Silverman , Muhammad A. Alam Gate dielectric breakdown in the time-scale of ESD events. [Citation Graph (0, 0)][DBLP ] Journal ] Steven H. Voldman A review of CMOS latchup and electrostatic discharge (ESD) in bipolar complimentary MOSFET (BiCMOS) Silicon Germanium technologies: Part II - Latchup. [Citation Graph (0, 0)][DBLP ] Journal ] V. A. Vashchenko , P. Hopper Bipolar SCR ESD devices. [Citation Graph (0, 0)][DBLP ] Journal ] Ji-hyuk Lim , Keon Kuk , Seung-joo Shin , Seog-soon Baek , Young-Jae Kim , Jong-woo Shin , Yong-soo Oh Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation. [Citation Graph (0, 0)][DBLP ] Journal ] C. Petit , A. Meinertzhagen , D. Zander , O. Simonetti , M. Fadlallah , T. Maurel Low voltage SILC and P- and N-MOSFET gate oxide reliability. [Citation Graph (0, 0)][DBLP ] Journal ] D. Goguenheim , A. Bravaix , S. Gomri , J. M. Moragues , C. Monserie , N. Legrand , P. Boivin Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies. [Citation Graph (0, 0)][DBLP ] Journal ] I. Cortés , J. Roig , D. Flores , J. Urresti , S. Hidalgo , J. Rebollo Analysis of hot-carrier degradation in a SOI LDMOS transistor with a steep retrograde drift doping profile. [Citation Graph (0, 0)][DBLP ] Journal ] Alessandro Marras , Ilaria De Munari , Davide Vescovi , Paolo Ciampolini Impact of gate-leakage currents on CMOS circuit performance. [Citation Graph (0, 0)][DBLP ] Journal ] Ramana Murthy , Y. W. Chen , A. Krishnamoorthy , X. T. Chen SiLKTM etch optimization and electrical characterization for 0.13 mum interconnects. [Citation Graph (0, 0)][DBLP ] Journal ] C. F. Tsang , C. K. Chang , A. Krishnamoorthy , K. Y. Ee , Y. J. Su , H. Y. Li , W. H. Li , L. Y. Wong A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections. [Citation Graph (0, 0)][DBLP ] Journal ] J. de Vries , J. van Delft , C. Slob 100 mum Pitch flip chip on foil assemblies with adhesive interconnections. [Citation Graph (0, 0)][DBLP ] Journal ] Ying Wang , Changchun Zhu , Chunyu Wu , Junhua Liu Improving reliability of beveled power semiconductor devices passivated by SIPOS. [Citation Graph (0, 0)][DBLP ] Journal ] N. Nenadovic , V. Cuoco , S. J. C. H. Theeuwen , L. K. Nanver , H. Schellevis , G. Spierings , H. F. F. Jos , J. W. Slotboom Electrothermal characterization of silicon-on-glass VDMOSFETs. [Citation Graph (0, 0)][DBLP ] Journal ] Ivan N. Ndip , Grit Sommer , Werner John , Herbert Reichl Characterization of bump arrays at RF/microwave frequencies. [Citation Graph (0, 0)][DBLP ] Journal ] Yi Tao , Ajay P. Malshe Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E. [Citation Graph (0, 0)][DBLP ] Journal ] Tadanori Shimoto , Kazuhiro Baba , Koji Matsui , Jun Tsukano , Takehiko Maeda , Kenji Oyachi Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs. [Citation Graph (0, 0)][DBLP ] Journal ] Yi-Shao Lai , Tong Hong Wang Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. [Citation Graph (0, 0)][DBLP ] Journal ] L. Frisk , Eero Ristolainen Flip chip attachment on flexible LCP substrate using an ACF. [Citation Graph (0, 0)][DBLP ] Journal ] M. J. Rizvi , Y. C. Chan , C. Bailey , H. Lu Study of anisotropic conductive adhesive joint behavior under 3-point bending. [Citation Graph (0, 0)][DBLP ] Journal ] Hua Lu , Jesse Zhou , Rich Golek , Ming Zhou Hybrid reliability assessment for packaging prototyping. [Citation Graph (0, 0)][DBLP ] Journal ] Dongsu Ryu , Seogweon Chang Novel concepts for reliability technology. [Citation Graph (0, 0)][DBLP ] Journal ] L. Zhang , G. Subbarayan , B. C. Hunter , D. Rose Response surface models for efficient, modular estimation of solder joint reliability in area array packages. [Citation Graph (0, 0)][DBLP ] Journal ] Jinwon Joo , Seungmin Cho , Bongtae Han Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. [Citation Graph (0, 0)][DBLP ] Journal ] K. S. Kim , K. W. Ryu , C. H. Yu , J. M. Kim The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces. [Citation Graph (0, 0)][DBLP ] Journal ] C. T. Pan , P. J. Cheng , M. F. Chen , C. K. Yen Intermediate wafer level bonding and interface behavior. [Citation Graph (0, 0)][DBLP ] Journal ] Tuomas F. Waris , Markus P. K. Turunen , Tomi Laurila , Jorma K. Kivilahti Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate. [Citation Graph (0, 0)][DBLP ] Journal ] Sam Siau , Johan De Baets , André Van Calster , Leon Heremans , Sammy Tanghe Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. [Citation Graph (0, 0)][DBLP ] Journal ] Yi He Chemical and diffusion-controlled curing kinetics of an underfill material. [Citation Graph (0, 0)][DBLP ] Journal ] T. Islam , C. Pramanik , H. Saha Modeling, simulation and temperature compensation of porous polysilicon capacitive humidity sensor using ANN technique. [Citation Graph (0, 0)][DBLP ] Journal ] Sasa Radovanovic , Anne-Johan Annema , Bram Nauta Bandwidth of integrated photodiodes in standard CMOS for CD/DVD applications. [Citation Graph (0, 0)][DBLP ] Journal ] Luke Maguire , Masud Behnia , Graham Morrison Systematic evaluation of thermal interface materials - a case study in high power amplifier design. [Citation Graph (0, 0)][DBLP ] Journal ] Maria Teresa Sanz , Santiago Celma , Belén Calvo , Juan P. Alegre MOS current divider based PGA. [Citation Graph (0, 0)][DBLP ] Journal ] 