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Microelectronics Reliability
2006, volume: 46, number: 5-6

  1. Natarajan Mahadeva Iyer
    Introduction to special section on selected papers from EOS/ESD Symposium 2004. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:655- [Journal]
  2. Charvaka Duvvury, Robert Steinhoff, Gianluca Boselli, Vijay Reddy, Hans Kunz, Steve Marum, Roger Cline
    Gate oxide failures due to anomalous stress from HBM ESD testers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:656-665 [Journal]
  3. M. Etherton, N. Qu, J. Willemen, Wolfgang Wilkening, S. Mettler, M. Dissegna, R. Stella, L. Zullino, A. Andreini, Horst A. Gieser
    Study of CDM specific effects for a smart power input protection structure. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:666-676 [Journal]
  4. Bart Keppens, Markus P. J. Mergens, Cong Son Trinh, Christian C. Russ, Benjamin Van Camp, Koen G. Verhaege
    ESD protection solutions for high voltage technologies. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:677-688 [Journal]
  5. K. Domanski, B. Póltorak, S. Bargstädt-Franke, Wolfgang Stadler, W. Bala
    Physical fundamentals of external transient latch-up and corrective actions. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:689-701 [Journal]
  6. S. Thijs, M. Natarajan Iyer, D. Linten, W. Jeamsaksiri, T. Daenen, Robin Degraeve, Andries Scholten, S. Decoutere, Guido Groeseneken
    Implementation of plug-and-play ESD protection in 5.5GHz 90nm RF CMOS LNAs - Concepts, constraints and solutions. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:702-712 [Journal]
  7. Ranbir Singh
    Reliability and performance limitations in SiC power devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:713-730 [Journal]
  8. F. J. García Sánchez, Adelmo Ortiz-Conde, J. Muci
    Understanding threshold voltage in undoped-body MOSFETs: An appraisal of various criteria. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:731-742 [Journal]
  9. Maciej Wolborski, Mietek Bakowski, Armando Ortiz, Viljami Pore, Adolf Schöner, Mikko Ritala, Markku Leskelä, Anders Hallén
    Characterisation of the Al2O3 films deposited by ultrasonic spray pyrolysis and atomic layer deposition methods for passivation of 4H-SiC devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:743-755 [Journal]
  10. Takayoshi Katahira, Ilkka Kartio, Hiroshi Segawa, Michimasa Takahashi, Katsumi Sagisaka
    Vertically high-density interconnection for mobile application. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:756-762 [Journal]
  11. M. Y. Pan, M. Gupta, A. A. O. Tay, K. Vaidyanathan
    Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:763-767 [Journal]
  12. Oliver Aubel, Eberhard Bugiel, Dietmar Krüger, Wolfgang Hasse, Martina Hommel
    Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:768-773 [Journal]
  13. Xu Chen, Jun Zhang, Chunlei Jiao, Yanmin Liu
    Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:774-785 [Journal]
  14. Y. Guhel, B. Boudart, E. Delos, M. Germain, Z. Bougrioua
    Comparative studies of Pt and Ir schottky contacts on undoped Al0.36Ga0.64N. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:786-793 [Journal]
  15. Amy S. Fleischer, Li-hsin Chang, Barry C. Johnson
    The effect of die attach voiding on the thermal resistance of chip level packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:794-804 [Journal]
  16. Zunxian Yang, Ying Yu, Xinxin Li, Haifei Bao
    Nano-mechanical electro-thermal probe array used for high-density storage based on NEMS technology. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:805-810 [Journal]
  17. Guang-Ming Zhang, David M. Harvey, Derek R. Braden
    Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:811-821 [Journal]
  18. W. Dreyer, F. Duderstadt, S. Eichler, M. Jurisch
    Stress analysis and bending tests for GaAs wafers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:822-835 [Journal]
  19. Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar
    Effect of wafer thinning methods towards fracture strength and topography of silicon die. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:836-845 [Journal]
  20. Tong Fang, Michael D. Osterman, Michael G. Pecht
    Statistical analysis of tin whisker growth. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:846-849 [Journal]
  21. M. Yamashita, K. Suganuma
    Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:850-858 [Journal]
  22. Yi-Shao Lai
    On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:859-863 [Journal]
  23. Bo Tao, Yiping Wu, Han Ding, You-Lun Xiong
    A quantitative method of reliability estimation for surface mount solder joints based on heating factor Qeta. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:864-872 [Journal]
  24. H. R. Ghorbani, J. K. Spelt
    Interfacial thermal stresses in solder joints of leadless chip resistors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:873-884 [Journal]
  25. Chang-Lin Yeh, Yi-Shao Lai
    Transient fracturing of solder joints subjected to displacement-controlled impact loads. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:885-895 [Journal]
  26. W.-M. Chen, Paul McCloskey, S. Cian O'Mathuna
    Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:896-904 [Journal]
  27. Jeong-Won Yoon, Seung-Boo Jung
    High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:905-914 [Journal]
  28. Yi-Shao Lai, Chin-Li Kao
    Characteristics of current crowding in flip-chip solder bumps. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:915-922 [Journal]
  29. Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto
    Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:923-929 [Journal]
  30. E. H. Wong, Y.-W. Mai
    New insights into board level drop impact. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:930-938 [Journal]
  31. Cher Ming Tan, Zhenghao Gan, Tai Chong Chai
    Feasibility study of the application of voltage contrast to printed circuit board. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:939-948 [Journal]
  32. A. Dabrowski, R. Dlugosz, P. Pawlowski
    Integrated CMOS GSM baseband channel selecting filters realized using switched capacitor finite impulse response technique. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:949-958 [Journal]
  33. Amir Rajabzadeh, Seyed Ghassem Miremadi
    CFCET: A hardware-based control flow checking technique in COTS processors using execution tracing. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:959-972 [Journal]
  34. Jing Lee
    A reliability-driven placement procedure based on thermal-force model. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:973-983 [Journal]
  35. J. Jilesen, F. S. Lien, H. Ahn
    Investigation of increased performance of close series stacked tube axial fans due to inclusion of diffuser element. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:984-993 [Journal]
  36. H. Maanane, M. Masmoudi, J. Marcon, M. A. Belaïd, K. Mourgues, C. Tolant, K. Ketata, Ph. Eudeline
    Study of RF N- LDMOS critical electrical parameter drifts after a thermal and electrical ageing in pulsed RF. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:994-1000 [Journal]
  37. Zhilin Sun, Weifeng Sun, Yangbo Yi, Longxing Shi
    Study of the power capability of LDMOS and the improved methods. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:1001-1005 [Journal]
  38. H. Y. Kang, A. H. I. Lee
    Critical dimension control in photolithography based on the yield by a simulation program. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:1006-1012 [Journal]
  39. B. Foucher, J. Tomas, F. Mounsi, M. Jeremias
    Life margin assessment with Physics of Failure Tools application to BGA packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:1013-1018 [Journal]
  40. Krystyna Siekierska, Pawel Fras, Artur Kokoszka, Tomasz Kostienko, Norbert Lugowski, Dariusz Obrebski, Adam Pawlak, Piotr Penkala, Dariusz Stachanczyk, Marek Szlezak
    Distributed collaborative design of IP components in the TRMS environment. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:1019-1024 [Journal]
  41. Mile K. Stojcev
    F. Mayer-Linderberg, Dedicated Digital Processors: Methods in Hardware/Software System Design, John Wiley & Sons, Ltd., Chichester (2004) ISBN 0-470-84444-2 Hardcover, pp 302, plus XI. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:1025-1026 [Journal]
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