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Microelectronics Reliability
2006, volume: 46, number: 2-4

  1. Sasan Naseh, M. Jamal Deen, Chih-Hung Chen
    Hot-carrier reliability of submicron NMOSFETs and integrated NMOS low noise amplifiers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:201-212 [Journal]
  2. C.-K. Hu, L. Gignac, R. Rosenberg
    Electromigration of Cu/low dielectric constant interconnects. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:213-231 [Journal]
  3. F. Chen, J. Gill, D. Harmon, T. Sullivan, A. Strong, B. Li, H. Rathore, D. Edelstein
    Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:232-243 [Journal]
  4. S. Manian Ramkumar, Reza Ghaffarian, Arun Varanasi
    Lead-free 0201 manufacturing, assembly and reliability test results. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:244-262 [Journal]
  5. Mitsuo Fukuda
    Optical source reliability in recent optical fiber transmission systems and consumer electronics. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:263-269 [Journal]
  6. James H. Stathis, S. Zafar
    The negative bias temperature instability in MOS devices: A review. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:270-286 [Journal]
  7. M. Ossaimee, K. Kirah, W. Fikry, A. Girgis, O. A. Omar
    Simplified quantitative stress-induced leakage current (SILC) model for MOS devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:287-292 [Journal]
  8. Alexander Zemliak, Roque De La Cruz
    Numerical analysis of a double avalanche region IMPATT diode on the basis of nonlinear model. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:293-300 [Journal]
  9. Kun-Hsien Lin, Ming-Dou Ker
    Electrostatic discharge protection scheme without leakage current path for CMOS IC operating in power-down-mode condition on a system board. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:301-310 [Journal]
  10. A. T. Hatzopoulos, D. H. Tassis, N. Arpatzanis, C. A. Dimitriadis, G. Kamarinos
    Effects of hot carriers in offset gated polysilicon thin-film transistors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:311-316 [Journal]
  11. A. M. Albadri, R. D. Schrimpf, K. F. Galloway, D. G. Walker
    Single event burnout in power diodes: Mechanisms and models. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:317-325 [Journal]
  12. Mohammadreza Keimasi, Sanka Ganesan, Michael G. Pecht
    Low temperature electrical measurements of silicon bipolar monolithic microwave integrated circuit (MMIC) amplifiers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:326-334 [Journal]
  13. K. M. Chen, B. C. Wu, K. H. Tang, F. Y. Cheng, N. H. Kao, J. Y. Lai
    An investigation into the effects of probing and wire bonding stress on the reliability of BOAC. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:335-342 [Journal]
  14. C. Pramanik, T. Islam, H. Saha
    Temperature compensation of piezoresistive micro-machined porous silicon pressure sensor by ANN. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:343-351 [Journal]
  15. Andrzej Dziedzic, Andrzej Kolek, Waleed Ehrhardt, Heiko Thust
    Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:352-359 [Journal]
  16. Sanka Ganesan, Michael G. Pecht, Sharon Ling
    Use of high temperature operating life data to mitigate risks in long-duration space applications that deploy commercial-grade plastic encapsulated semiconductor devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:360-366 [Journal]
  17. Mohd Khairuddin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar
    The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:367-379 [Journal]
  18. Jamil A. Wakil
    Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:380-385 [Journal]
  19. Yi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang
    Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:386-399 [Journal]
  20. Daniel N. Donahoe, Michael G. Pecht, Isabel K. Lloyd, Sanka Ganesan
    Moisture induced degradation of multilayer ceramic capacitors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:400-408 [Journal]
  21. Y. L. Zhang, D. X. Q. Shi, W. Zhou
    Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:409-420 [Journal]
  22. A. S. Fleischer, U. Troppenz, M. Hamacher, W. John
    Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:421-431 [Journal]
  23. Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi
    Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:432-439 [Journal]
  24. Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang
    Thermal resistance analysis and validation of flip chip PBGA packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:440-448 [Journal]
  25. Cheng-Li Chuang, Jong-Ning Aoh, Rong-Fong Din
    Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:449-458 [Journal]
  26. Youngbae Kim, Hiroshi Noguchi, Masazumi Amagai
    Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:459-466 [Journal]
  27. Sarangapani Murali, Narasimalu Srikanth, Charles J. Vath III
    Effect of wire diameter on the thermosonic bond reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:467-475 [Journal]
  28. M. Y. Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu
    Thermal deformation measurements and predictions of MAP-BGA electronic packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:476-486 [Journal]
  29. Changsoo Jang, Seongyoung Han, Hangyu Kim, Sayoon Kang
    A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:487-495 [Journal]
  30. Michael C. Larson, Melody A. Verges, Xia Liu
    Residual compression in area array packages induced by underfill shrinkage. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:496-502 [Journal]
  31. Jongwoo Park, John Osenbach
    Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:503-511 [Journal]
  32. Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik
    Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:512-522 [Journal]
  33. Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang
    Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:523-534 [Journal]
  34. Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
    Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:535-542 [Journal]
  35. C. D. Breach, F. Wulff, C. W. Tok
    An unusual mechanical failure mode in gold ballbonds at 50mum pitch due to degradation at the Au-Au4Al interface during ageing in air at 175degreeC. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:543-557 [Journal]
  36. Yuqi Wang, K. H. Low, H. L. J. Pang, K. H. Hoon, F. X. Che, Y. S. Yong
    Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:558-573 [Journal]
  37. Yan Qi, Rex Lam, Hamid R. Ghorbani, Polina Snugovsky, Jan K. Spelt
    Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:574-588 [Journal]
  38. Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik
    Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:589-599 [Journal]
  39. Fei Su, Kerm Sin Chian, Sung Yi
    An optical characterization technique for hygroscopic expansion of polymers and plastic packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:600-609 [Journal]
  40. Lei Han, Fuliang Wang, Wenhu Xu, Jue Zhong
    Bondability window and power input for wire bonding. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:610-615 [Journal]
  41. W. Dauksher, P. Marcoux, G. Castleman
    A methodology for the calculation of stress migration in die-level interconnects. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:616-625 [Journal]
  42. Chang-Lin Yeh, Yi-Shao Lai
    Support excitation scheme for transient analysis of JEDEC board-level drop test. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:626-636 [Journal]
  43. L. Chen, O. J. Guy, D. Doneddu, S. G. J. Batcup, S. P. Wilks, P. A. Mawby, T. Bouchet, F. Torregrosa
    Report on 4H-SiC JTE Schottky diodes. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:637-640 [Journal]
  44. V. S. Pershenkov, A. D. Tremasov, V. V. Belyakov, A. U. Razvalyaev, V. S. Mochkin
    X-ray ion mobility spectrometer. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:641-644 [Journal]
  45. Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh
    Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:645-650 [Journal]
  46. Mile K. Stojcev
    Sachin Sapatnekar, Timing, Kluwer Academic Publishers, Hardcover, ISBN 1-4020-7671-1, pp 294, plus IX. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:651-652 [Journal]
  47. Mile K. Stojcev
    Low Power Electronics Design, Christian Pignet, Editor, CRC Press, Boca Raton, 2005, Hardcover, pp 854, plus 18, ISBN 0-8493-1941-2. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:653-654 [Journal]
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