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Journals in DBLP

Microelectronics Reliability
2006, volume: 46, number: 8

  1. Peter Ersland, Roberto Menozzi
    Editorial. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1217- [Journal]
  2. William J. Roesch
    Historical review of compound semiconductor reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1218-1227 [Journal]
  3. Charles S. Whitman, Terri M. Gilbert, Ann M. Rahn, Jennifer A. Antonell
    Determining factors affecting ESD failure voltage using DOE. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1228-1237 [Journal]
  4. William J. Roesch
    Compound semiconductor activation energy in humidity. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1238-1246 [Journal]
  5. S. Singhal, T. Li, A. Chaudhari, A. W. Hanson, R. Therrien, J. W. Johnson, W. Nagy, J. Marquart, P. Rajagopal, J. C. Roberts
    Reliability of large periphery GaN-on-Si HFETs. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1247-1253 [Journal]
  6. Shivarajiv Somisetty, Peter Ersland, Xinxing Yang, Jason Barrett
    Reliability investigation and characterization of failure modes in Schottky diodes. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1254-1260 [Journal]
  7. Charles S. Whitman
    Reliability results of HBTs with an InGaP emitter. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1261-1271 [Journal]
  8. Craig Gaw, Thomas Arnold, Robert Martin, Lisa Zhang, Dragan Zupac
    Evaluation of SiGe: C HBT intrinsic reliability using conventional and step stress methodologies. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1272-1278 [Journal]
  9. P. J. van der Wel, S. J. C. H. Theeuwen, J. A. Bielen, Y. Li, R. A. van den Heuvel, J. G. Gommans, F. van Rijs, P. Bron, H. J. F. Peuscher
    Wear out failure mechanisms in aluminium and gold based LDMOS RF power applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1279-1284 [Journal]
  10. Javier A. Salcedo, Juin J. Liou, Muhammad Yaqub Afridi, Allen R. Hefner
    On-chip electrostatic discharge protection for CMOS gas sensor systems-on-a-chip (SoC). [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1285-1294 [Journal]
  11. A. Kumta, Rusli, Chin-Che Tin, J. Ahn
    Design of field-plate terminated 4H-SiC Schottky diodes using high-k dielectrics. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1295-1302 [Journal]
  12. A. A. Dakhel
    Study of dc conduction mechanisms in dysprosium-manganese oxide insulator thin films grown on Si substrates. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1303-1308 [Journal]
  13. H. S. Nguyen, Z. H. Gan, Zhe Chen, V. Chandrasekar, K. Prasad, S. G. Mhaisalkar, Ning Jiang
    Reliability studies of barrier layers for Cu/PAE low-k interconnects. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1309-1314 [Journal]
  14. Petar Ratchev, Serguei Stoukatch, Bart Swinnen
    Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1315-1325 [Journal]
  15. Ching-Yang Chen, Yung-Ching Chao, De-Shin Liu, Zhen-Wei Zhuang
    Design of a novel chip on glass package solution for CMOS image sensor device. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1326-1334 [Journal]
  16. T. Kangasvieri, O. Nousiainen, J. Putaala, R. Rautioaho, J. Vähäkangas
    Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1335-1347 [Journal]
  17. H. T. Chen, C. Q. Wang, M. Y. Li
    Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1348-1356 [Journal]
  18. Yi-Shao Lai, Chin-Li Kao
    Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1357-1368 [Journal]
  19. C. T. Pan, P. J. Cheng, C. K. Yen, C. C. Hsieh
    Application of polyimide to bending-mode microactuators with Ni/Fe and Fe/Pt magnet. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1369-1381 [Journal]
  20. Vanco B. Litovski, Miona Andrejevic, Mark Zwolinski
    Analogue electronic circuit diagnosis based on ANNs. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1382-1391 [Journal]
  21. M. Y. Yan, K. N. Tu, A. V. Vairagar, S. G. Mhaisalkar, Ahila Krishnamoorthy
    A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1392-1395 [Journal]
  22. Mile K. Stojcev
    Alfredo Benso, Paolo Prinetto, editors, Fault injection techniques and tools for embedded systems reliability and evaluation, Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 241, plus XIV, ISBN 1-4020-7589-8. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1396-1397 [Journal]
  23. Mile K. Stojcev
    Sachin Sapatnekar, Timing, Kluwer Academic Publishers, Hardcover, pp 294, plus IX, ISBN 1-4020-7671-1. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1398-1399 [Journal]
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