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Microelectronics Reliability
2007, volume: 47, number: 2-3

  1. Artur Wymyslowski, Bart Vandevelde, Dag Andersson
    Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:159-160 [Journal]
  2. F. Cacho, S. Orain, G. Cailletaud, H. Jaouen
    A constitutive single crystal model for the silicon mechanical behavior: Applications to the stress induced by silicided lines and STI in MOS technologies. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:161-167 [Journal]
  3. Stephan Schoenfelder, Matthias Ebert, Christof Landesberger, Karlheinz Bock, Jörg Bagdahn
    Investigations of the influence of dicing techniques on the strength properties of thin silicon. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:168-178 [Journal]
  4. M. A. J. van Gils, O. van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken
    Analysis of Cu/low-k bond pad delamination by using a novel failure index. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:179-186 [Journal]
  5. Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Berhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel
    Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:187-195 [Journal]
  6. Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang
    Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:196-204 [Journal]
  7. W. D. van Driel, A. Mavinkurve, M. A. J. van Gils, G. Q. Zhang
    Advanced structural similarity rules for the BGA package family. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:205-214 [Journal]
  8. Nele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans
    Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:215-222 [Journal]
  9. Steffen Wiese, Klaus-Jürgen Wolter
    Creep of thermally aged SnAgCu-solder joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:223-232 [Journal]
  10. D. G. Yang, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen
    Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:233-239 [Journal]
  11. C. van't Hof, K. M. B. Jansen, G. Wisse, L. J. Ernst, D. G. Yang, G. Q. Zhang, H. J. L. Bressers
    Novel shear tools for viscoelastic characterization of packaging polymers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:240-247 [Journal]
  12. V. Gonda, K. M. B. Jansen, L. J. Ernst, J. den Toonder, G. Q. Zhang
    Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:248-251 [Journal]
  13. M. Spraul, W. Nüchter, A. Möller, B. Wunderle, B. Michel
    Reliability of SnPb and Pb-free flip-chips under different test conditions. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:252-258 [Journal]
  14. Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne
    Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:259-265 [Journal]
  15. C. Andersson, D. R. Andersson, P. E. Tegehall, Johan Liu
    Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:266-272 [Journal]
  16. M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, R. B. R. van Silfhout, X. J. Fan, J. H. J. Janssen
    Virtual qualification of moisture induced failures of advanced packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:273-279 [Journal]
  17. A. Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang
    Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:280-289 [Journal]
  18. H. J. L. Bressers, W. D. van Driel, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang
    Correlation between chemistry of polymer building blocks and microelectronics reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:290-294 [Journal]
  19. S. Orain, J.-C. Barbé, X. Federspiel, P. Legallo, H. Jaouen
    FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress-voiding. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:295-301 [Journal]
  20. Mats Lindgren, Ilja Belov, Magnus Törnvall, Peter Leisner
    Application of simulation-based decision making in product development of an RF module. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:302-309 [Journal]
  21. D. G. Yang, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
    Numerical modeling of warpage induced in QFN array molding process. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:310-318 [Journal]
  22. Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont
    Dynamic void formation in a DD-copper-structure with different metallization geometry. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:319-325 [Journal]
  23. Andrzej Dziedzic, Jan Felba
    Polytronic 2005. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:327- [Journal]
  24. James E. Morris
    Isotropic conductive adhesives: Future trends, possibilities and risks. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:328-330 [Journal]
  25. Jana Kolbe, Andreas Arp, Francesco Calderone, Edouard Marc Meyer, Wilhelm Meyer, Helmut Schaefer, Manuela Stuve
    Inkjettable conductive adhesive for use in microelectronics and microsystems technology. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:331-334 [Journal]
  26. Ryszard Kisiel, Jan Felba, Janusz Borecki, Andrzej Moscicki
    Problems of PCB microvias filling by conductive paste. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:335-341 [Journal]
  27. Tomasz Falat, Artur Wymyslowski, Jana Kolbe
    Numerical approach to characterization of thermally conductive adhesives. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:342-346 [Journal]
  28. Péter Gordon, Bálint Balogh, Bálint Sinkovics
    Thermal simulation of UV laser ablation of polyimide. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:347-353 [Journal]
  29. Andrzej Dziedzic
    Carbon/polyesterimide thick-film resistive composites - Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:354-362 [Journal]
  30. Marika P. Immonen, Mikko Karppinen, Jorma K. Kivilahti
    Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:363-371 [Journal]
  31. J. Tardy, M. Erouel, A. L. Deman, A. Gagnaire, V. Teodorescu, M. G. Blanchin, B. Canut, A. Barau, M. Zaharescu
    Organic thin film transistors with HfO2 high-k gate dielectric grown by anodic oxidation or deposited by sol-gel. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:372-377 [Journal]
  32. T. K. Chiang
    A new two-dimensional threshold voltage model for cylindrical, fully-depleted, surrounding-gate (SG) MOSFETs. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:379-383 [Journal]
  33. F. Schwierz, C. Schippel
    Performance trends of Si-based RF transistors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:384-390 [Journal]
  34. X. Zou, J. P. Xu, C. X. Li, P. T. Lai, W. B. Chen
    A threshold-voltage model of SiGe-channel pMOSFET without Si cap layer. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:391-394 [Journal]
  35. W. W. (Bill) Abadeer
    Effect of stress voltages on voltage acceleration and lifetime projections for ultra-thin gate oxides. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:395-400 [Journal]
  36. C. Petit, D. Zander
    Low voltage stress induced leakage current and time to breakdown in ultra-thin (1.2-2.3nm) oxides. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:401-408 [Journal]
  37. Kazufumi Watanabe, Akinobu Teramoto, Rihito Kuroda, Shigetoshi Sugawa, Tadahiro Ohmi
    Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:409-418 [Journal]
  38. You-Lin Wu, Shi-Tin Lin, Tsung-Min Chang, Juin J. Liou
    Reliability study of ultrathin oxide films subject to irradiation-then-stress treatment using conductive atomic force microscopy. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:419-421 [Journal]
  39. Z. Khatir, S. Lefebvre, F. Saint-Eve
    Experimental and numerical investigations on delayed short-circuit failure mode of single chip IGBT devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:422-428 [Journal]
  40. W. S. Lau, P. W. Qian, Taejoon Han, Nathan P. Sandler, S. T. Che, S. E. Ang, C. H. Tung, T. T. Sheng
    Evidence that N2O is a stronger oxidizing agent than O2 for both Ta2O5 and bare Si below 1000degreeC and temperature for minimum low-K interfacial oxide for high-K dielectric on Si. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:429-433 [Journal]
  41. Jianyin Zhao, Fang Liu
    Reliability assessment of the metallized film capacitors from degradation data. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:434-436 [Journal]
  42. B. Vermeersch, Gilbert De Mey
    Influence of substrate thickness on thermal impedance of microelectronic structures. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:437-443 [Journal]
  43. J. W. C. de Vries, M. Y. Jansen, W. D. van Driel
    On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:444-449 [Journal]
  44. Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong
    Dynamic responses and solder joint reliability under board level drop test. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:450-460 [Journal]
  45. Hamid R. Zarandi, Seyed Ghassem Miremadi
    Dependability evaluation of Altera FPGA-based embedded systems subjected to SEUs. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:461-470 [Journal]
  46. Maria Teresa Sanz, Santiago Celma, Belén Calvo
    Low-distortion 4th order programmable Butterworth filter. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:471-476 [Journal]
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