Journals in DBLP

Microelectronics Journal
2005, volume: 36, number: 7

1. Bernard Courtois
   Special issue on European Micro and Nano Systems (EMN04) held in Paris, 20-21 October, 2004. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2005, v:36, n:7, pp:613- [Journal]
   
2. Giuseppe Iannaccone
   Perspectives and challenges in nanoscale device modeling. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2005, v:36, n:7, pp:614-618 [Journal]
   
3. Gary H. Bernstein, Alexandra Imre, V. Metlushko, Alexei O. Orlov, L. Zhou, L. Ji, G. Csaba, Wolfgang Porod
   Magnetic QCA systems. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2005, v:36, n:7, pp:619-624 [Journal]
   
4. Y. Leprince-Wang, A. Yacoubi-Ouslim, G. Y. Wang
   Structure study of electrodeposited ZnO nanowires. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2005, v:36, n:7, pp:625-628 [Journal]
   
5. K. Kakushima, T. Bourouina, T. Sarnet, G. Kerrien, D. Débarre, J. Boulmer, H. Fujita
   Silicon periodic nano-structures obtained by laser exposure of nano-wires. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2005, v:36, n:7, pp:629-633 [Journal]
   
6. N. N. Dzbanovsky, V. V. Dvorkin, V. G. Pirogov, N. V. Suetin
   The aligned Si nanowires growth using MW plasma enhanced CVD. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2005, v:36, n:7, pp:634-638 [Journal]
   
7. Ibrahima Kante, Thierry Devers, Rachid Harba, Caroline Andreazza-Vignolle, Pascal Andreazza
   Electrical behaviour of fractal nanosized tin dioxide films prepared by electrodeposition for gas sensing applications. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2005, v:36, n:7, pp:639-643 [Journal]
   
8. Bradley E. Layton, Stephanie M. Sullivan, John J. Palermo, Gregory J. Buzby, Rishi Gupta, Richard E. Stallcup III
   Nanomanipulation and aggregation limitations of self-assembling structural proteins. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2005, v:36, n:7, pp:644-649 [Journal]
   
9. N. Wilke, A. Mulcahy, S.-R. Ye, A. Morrissey
   Process optimization and characterization of silicon microneedles fabricated by wet etch technology. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2005, v:36, n:7, pp:650-656 [Journal]
   
10. Haifa El-Sadi, Nabil Esmail
    Simulation of complex liquids in micropump. [Citation Graph (0, 0)][DBLP]
    Microelectronics Journal, 2005, v:36, n:7, pp:657-666 [Journal]
    
11. Jemmy S. Bintoro, Peter J. Hesketh, Yves H. Berthelot
    CMOS compatible bistable electromagnetic microvalve on a single wafer. [Citation Graph (0, 0)][DBLP]
    Microelectronics Journal, 2005, v:36, n:7, pp:667-672 [Journal]
    
12. F. Marty, L. Rousseau, B. Saadany, B. Mercier, O. Français, Y. Mita, T. Bourouina
    Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures. [Citation Graph (0, 0)][DBLP]
    Microelectronics Journal, 2005, v:36, n:7, pp:673-677 [Journal]
    
13. Gen-Wen Hsieh, Ching-Hsiang Tsai, Wei-Chih Lin
    Anodic bonding of glass and silicon wafers with an intermediate silicon nitride film and its application to batch fabrication of SPM tip arrays. [Citation Graph (0, 0)][DBLP]
    Microelectronics Journal, 2005, v:36, n:7, pp:678-682 [Journal]
    
14. A. Pavolotsky, D. Meledin, C. Risacher, M. Pantaleev, V. Belitsky
    Micromachining approach in fabricating of THz waveguide components. [Citation Graph (0, 0)][DBLP]
    Microelectronics Journal, 2005, v:36, n:7, pp:683-686 [Journal]