Journals in DBLP

Microelectronics Journal
2003, volume: 34, number: 3

1. Yogendra K. Joshi, Suresh V. Garimella
   Thermal challenges in next generation electronic systems. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2003, v:34, n:3, pp:169- [Journal]
   
2. Márta Rencz
   New possibilities in the thermal evaluation, offered by transient testing. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2003, v:34, n:3, pp:171-177 [Journal]
   
3. Liwei Lin
   Thermal challenges in MEMS applications: phase change phenomena and thermal bonding processes. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2003, v:34, n:3, pp:179-185 [Journal]
   
4. M. J. Rightley, C. P. Tigges, R. C. Givler, C. V. Robino, J. J. Mulhall, P. M. Smith
   Innovative wick design for multi-source, flat plate heat pipes. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2003, v:34, n:3, pp:187-194 [Journal]
   
5. Osamu Suzuki, Yogendra K. Joshi, Wataru Nakayama
   Dynamics of a liquid plug in a capillary duct powered by vapor explosion. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2003, v:34, n:3, pp:195-200 [Journal]
   
6. Taofang Zeng, Gang Chen
   Nonequilibrium electron and phonon transport and energy conversion in heterostructures. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2003, v:34, n:3, pp:201-206 [Journal]
   
7. M. A. Baig, M. Z. H. Khandkar, J. A. Khan, M. A. Khan, G. Simin, H. Wang
   A study of temperature field in a GaN heterostructure field-effect transistor. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2003, v:34, n:3, pp:207-214 [Journal]
   
8. J. P. Gwinn, R. L. Webb
   Performance and testing of thermal interface materials. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2003, v:34, n:3, pp:215-222 [Journal]
   
9. S. Moghaddam, M. Rada, A. Shooshtari, M. Ohadi, Y. Joshi
   Evaluation of analytical models for thermal analysis and design of electronic packages. [Citation Graph (0, 0)][DBLP]
   Microelectronics Journal, 2003, v:34, n:3, pp:223-230 [Journal]