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Paper info

Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo
Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. [Citation Graph (0, 0)][DBLP]
Microelectronics Journal, 2003, v:34, n:2, pp:109-113 [Journal]

Scores and Rank
SCEAS: 0.41721
SCEAS_PS: 0
SCEAS_BPS: 0
SCEAS_EPS: 0
SCEAS_BEPS: 0
SCEAS_B0: 3.11202
PAGE_RANK: 0.48050
HITS_H: 0
HITS_A: 0
BHITS_H: 0
BHITS_A: 0
SALSA_A: 0
SALSA_H: 0
BSALSA_A: 0
BSALSA_H: 0
P: 0
BCC: 0
citations_to_me: 0
citations_from_me: 0



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NOTICE1
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NOTICE2
The rankings that are presented on this page should NOT be considered as formal since the citation info is incomplete in DBLP
 
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