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Publications of Author

1. J. Balachandran, Steven Brebels, G. Carchon, T. Webers, Walter De Raedt, Bart Nauwelaers, Eric Beyne
   Analysis and modeling of power grid transmission lines. [Citation Graph (0, 0)][DBLP]
   DATE, 2006, pp:33-38 [Conf]
   
2. Hasan Ymeri, Bart Nauwelaers, Karen Maex, David De Roest, Michele Stucchi, Servaas Vandenberghe
   Simple and Efficient Approach for Shunt Admittance Parameters Calculations of VLSI On-Chip Interconnects on Semiconducting Substrate. [Citation Graph (0, 0)][DBLP]
   DATE, 2002, pp:1113- [Conf]
   
3. J. Balachandran, Steven Brebels, G. Carchon, Walter De Raedt, Eric Beyne, M. Kuijk, Bart Nauwelaers
   Constant Impedance Scaling Paradigm for Scaling LC transmission lines. [Citation Graph (0, 0)][DBLP]
   ISQED, 2006, pp:387-392 [Conf]
   
4. J. Balachandran, Steven Brebels, G. Carchon, M. Kuijk, Walter De Raedt, Bart Nauwelaers, Eric Beyne
   Constant impedance scaling paradigm for interconnect synthesis. [Citation Graph (0, 0)][DBLP]
   SLIP, 2006, pp:99-105 [Conf]
   
5. J. Balachandran, Steven Brebels, G. Carchon, T. Webers, Walter De Raedt, Bart Nauwelaers, Eric Beyne
   Package level interconnect options. [Citation Graph (0, 0)][DBLP]
   SLIP, 2005, pp:21-27 [Conf]
   
6. Hasan Ymeri, Bart Nauwelaers, Karen Maex
   Computation of capacitance matrix for integrated circuit interconnects using semi-analytic Green's function method. [Citation Graph (0, 0)][DBLP]
   Integration, 2000, v:30, n:1, pp:55-63 [Journal]
   
7. Hasan Ymeri, Bart Nauwelaers, Karen Maex
   Frequency-dependent mutual resistance and inductance formulas for coupled IC interconnects on an Si-SiO2 substrate. [Citation Graph (0, 0)][DBLP]
   Integration, 2001, v:30, n:2, pp:133-141 [Journal]
   
8. J. Balachandran, Steven Brebels, G. Carchon, M. Kuijk, Walter De Raedt, Bart Nauwelaers, Eric Beyne
   Wafer-level package interconnect options. [Citation Graph (0, 0)][DBLP]
   IEEE Trans. VLSI Syst., 2006, v:14, n:6, pp:654-659 [Journal]
   
9. Hasan Ymeri, Bart Nauwelaers, Karen Maex, Servaas Vandenberghe, David De Roest
   A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate. [Citation Graph (0, 0)][DBLP]
   Microprocessors and Microsystems, 2002, v:26, n:1, pp:45-48 [Journal]
   
10. Arun Chandrasekhar, Steven Brebels, Serguei Stoukatch, Eric Beyne, Walter De Raedt, Bart Nauwelaers
    The influence of packaging materials on RF performance. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:351-357 [Journal]
    
11. 
    A Robust Semantic Overlay Network for Microgrid Control Applications. [Citation Graph (, )][DBLP]