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O. Sam Nakagawa: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Norman Chang, Shen Lin, O. Sam Nakagawa, Weize Xie, Lei He
    Clocktree RLC Extraction with Efficient Inductance Modeling. [Citation Graph (0, 0)][DBLP]
    DATE, 2000, pp:522-0 [Conf]
  2. Norman Chang, Valery Kanevsky, O. Sam Nakagawa, Khalid Rahmat, Soo-Young Oh
    Fast Generation of Statistically-based Worst-Case Modeling of On-Chip Interconnect. [Citation Graph (0, 0)][DBLP]
    ICCD, 1997, pp:720-725 [Conf]
  3. Soo-Young Oh, Khalid Rahmat, O. Sam Nakagawa, J. Moll
    A Scaling Scheme and Optimization Methodology for Deep Sub-Micron Interconnect. [Citation Graph (0, 0)][DBLP]
    ICCD, 1996, pp:320-325 [Conf]
  4. Yu Cao, Xuejue Huang, Chenming Hu, Norman Chang, Shen Lin, O. Sam Nakagawa, Weize Xie
    Effective On-chip Inductance Modeling for Multiple Signal Lines and Application on Repeater Insertion. [Citation Graph (0, 0)][DBLP]
    ISQED, 2001, pp:185-190 [Conf]
  5. Shen Lin, Norman Chang, O. Sam Nakagawa
    Quick On-Chip Self- and Mutual-Inductance Screen. [Citation Graph (0, 0)][DBLP]
    ISQED, 2000, pp:513-0 [Conf]
  6. Zhenyu Tang, Lei He, Norman Chang, Shen Lin, Weize Xie, Sam Nakagawa
    Instruction Prediction for Step Power Reduction. [Citation Graph (0, 0)][DBLP]
    ISQED, 2001, pp:211-216 [Conf]
  7. Zhiping Yu, Dan Yergeau, Robert W. Dutton, Sam Nakagawa, Norman Chang, Shen Lin, Weize Xie
    Full Chip Thermal Simulation. [Citation Graph (0, 0)][DBLP]
    ISQED, 2000, pp:145-150 [Conf]
  8. Zhenyu Tang, Norman Chang, Shen Lin, Weize Xie, O. Sam Nakagawa, Lei He
    Ramp Up/Down Functional Unit to Reduce Step Power. [Citation Graph (0, 0)][DBLP]
    PACS, 2000, pp:13-24 [Conf]
  9. Yu Cao, Xuejue Huang, N. H. Chang, Shen Lin, O. Sam Nakagawa, Weize Xie, Dennis Sylvester, Chenming Hu
    Effective on-chip inductance modeling for multiple signal lines and application to repeater insertion. [Citation Graph (0, 0)][DBLP]
    IEEE Trans. VLSI Syst., 2002, v:10, n:6, pp:799-805 [Journal]

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