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Okan Erdogan: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Jong-Ru Guo, Chao You, Michael Chu, Robert W. Heikaus, Kuan Zhou, Okan Erdogan, Jiedong Diao, Bryan S. Goda, Russell P. Kraft, John F. McDonald
    The gigahertz FPGA: design consideration and applications. [Citation Graph (0, 0)][DBLP]
    FPGA, 2004, pp:248- [Conf]
  2. Chao You, Jong-Ru Guo, Russell P. Kraft, Michael Chu, Robert W. Heikaus, Okan Erdogan, Peter F. Curran, Bryan S. Goda, Kuan Zhou, John F. McDonald
    Gigahertz FPGA by SiGe BiCMOS Technology for Low Power, High Speed Computing with 3-D Memory. [Citation Graph (0, 0)][DBLP]
    FPL, 2003, pp:11-20 [Conf]
  3. John Mayega, Okan Erdogan, Paul M. Belemjian, Kuan Zhou, John F. McDonald, Russell P. Kraft
    3D direct vertical interconnect microprocessors test vehicle. [Citation Graph (0, 0)][DBLP]
    ACM Great Lakes Symposium on VLSI, 2003, pp:141-146 [Conf]
  4. Jong-Ru Guo, Chao You, Michael Chu, Okan Erdogan, Russell P. Kraft, John F. McDonald
    A High Speed Reconfigurable Gate Array for Gigahertz Applications. [Citation Graph (0, 0)][DBLP]
    ISVLSI, 2005, pp:124-129 [Conf]
  5. Philip Jacob, Okan Erdogan, Aamir Zia, Paul M. Belemjian, Russell P. Kraft, John F. McDonald
    Predicting the Performance of a 3D Processor-Memory Chip Stack. [Citation Graph (0, 0)][DBLP]
    IEEE Design & Test of Computers, 2005, v:22, n:6, pp:540-547 [Journal]

  6. Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking. [Citation Graph (, )][DBLP]


  7. Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. [Citation Graph (, )][DBLP]


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