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Syed M. Alam: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Syed M. Alam, Donald E. Troxel, Carl V. Thompson
    Thermal aware cell-based full-chip electromigration reliability analysis. [Citation Graph (0, 0)][DBLP]
    ACM Great Lakes Symposium on VLSI, 2005, pp:26-31 [Conf]
  2. Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel
    Circuit Level Reliability Analysis of Cu Interconnects. [Citation Graph (0, 0)][DBLP]
    ISQED, 2004, pp:238-243 [Conf]
  3. Syed M. Alam, Donald E. Troxel, Carl V. Thompson
    A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits. [Citation Graph (0, 0)][DBLP]
    ISQED, 2002, pp:246-251 [Conf]
  4. Syed M. Alam, Frank L. Wei, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel
    Electromigration Reliability Comparison of Cu and Al Interconnects. [Citation Graph (0, 0)][DBLP]
    ISQED, 2005, pp:303-308 [Conf]
  5. Syed M. Alam, Robert E. Jones, Shahid Rauf, Ritwik Chatterjee
    Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology. [Citation Graph (0, 0)][DBLP]
    ISQED, 2007, pp:580-585 [Conf]

  6. Technology, CAD tools, and designs for emerging 3D integration technology. [Citation Graph (, )][DBLP]


  7. A Built-In Self-Test Scheme for Soft Error Rate Characterization. [Citation Graph (, )][DBLP]


  8. Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology. [Citation Graph (, )][DBLP]


  9. Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs. [Citation Graph (, )][DBLP]


  10. System-level comparison of power delivery design for 2D and 3D ICs. [Citation Graph (, )][DBLP]


  11. Study of Circuit-Specific Error Bounds for Fault-Tolerant Computation using Maximum a posteriori (MAP) Hypothesis [Citation Graph (, )][DBLP]


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