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Paul M. Belemjian: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. John Mayega, Okan Erdogan, Paul M. Belemjian, Kuan Zhou, John F. McDonald, Russell P. Kraft
    3D direct vertical interconnect microprocessors test vehicle. [Citation Graph (0, 0)][DBLP]
    ACM Great Lakes Symposium on VLSI, 2003, pp:141-146 [Conf]
  2. Philip Jacob, Okan Erdogan, Aamir Zia, Paul M. Belemjian, Russell P. Kraft, John F. McDonald
    Predicting the Performance of a 3D Processor-Memory Chip Stack. [Citation Graph (0, 0)][DBLP]
    IEEE Design & Test of Computers, 2005, v:22, n:6, pp:540-547 [Journal]

  3. Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking. [Citation Graph (, )][DBLP]

  4. Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. [Citation Graph (, )][DBLP]

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