F. Wang, Y. Y. Wang, C. Lu Failure probability of wire bonding packages. [Citation Graph (0, 0)][DBLP] International Journal of Computational Engineering Science, 2004, v:5, n:2, pp:379-386 [Journal]
Z. W. He, X. Q. Liu, D. Y. Xu, Y. Y. Wang Effect of annealing on the properties of low-k nanoporous SiO2 films prepared by sol-gel method with catalyst HF. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2006, v:46, n:12, pp:2062-2066 [Journal]
Stochastic Resonance Based Latency Delay Estimation for Weak Evoked Potentials with Impulsive Noises. [Citation Graph (, )][DBLP]
Finite Element Analysis and Comparison of Two Hybrid Robotsthe Tricept and the TriVariant. [Citation Graph (, )][DBLP]
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