G. Williams, K. Doughty, D. A. Bradley A systems approach to achieving CarerNet-an integrated and intelligent telecare system. [Citation Graph (0, 0)][DBLP] IEEE Transactions on Information Technology in Biomedicine, 1998, v:2, n:1, pp:1-9 [Journal]
A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing. [Citation Graph (, )][DBLP]
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