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William E. Burdick Jr.: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. William E. Burdick Jr., Wolfgang Daum
    High-Yield Multichip Modules Based on Minimal IC Pretest. [Citation Graph (0, 0)][DBLP]
    ITC, 1994, pp:30-40 [Conf]
  2. Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion
    Overlay High-Density Interconnect: A Chips-First Multichip Module Technology. [Citation Graph (0, 0)][DBLP]
    IEEE Computer, 1993, v:26, n:4, pp:23-29 [Journal]

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