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Franco Stellari: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Peilin Song, Franco Stellari, Alan J. Weger, Tian Xia
    A Novel Scan Chain Diagnostics Technique Based on Light Emission from Leakage Current. [Citation Graph (0, 0)][DBLP]
    ITC, 2004, pp:140-147 [Conf]
  2. Franco Stellari, Peilin Song, Moyra K. McManus, Robert Gauthier, Alan J. Weger, Kiran V. Chatty, Mujahid Muhammad, Pia Sanda
    Optical and Electrical Testing of Latchup in I/O Interface Circuits. [Citation Graph (0, 0)][DBLP]
    ITC, 2003, pp:236-245 [Conf]
  3. Franco Stellari, F. Zappa, S. Cova, L. Vendrame
    Tools for contactless testing and simulation of CMOS circuits. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:11, pp:1801-1808 [Journal]
  4. Franco Stellari, Peilin Song, James C. Tsang, Moyra K. McManus, Mark B. Ketchen
    Optical diagnosis of excess IDDQ in low power CMOS circuits. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1689-1694 [Journal]
  5. Franco Stellari, Peilin Song, Moyra K. McManus, Alan J. Weger, Robert Gauthier, Kiran V. Chatty, Mujahid Muhammad, Pia Sanda, Philip Wu, Steve Wilson
    Latchup Analysis Using Emission Microscopy. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:9-11, pp:1603-1608 [Journal]
  6. Alberto Tosi, Franco Stellari, F. Zappa, S. Cova
    Backside Flip-Chip testing by means of high-bandwidth luminescence detection. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:9-11, pp:1669-1674 [Journal]
  7. Romain Desplats, A. Eral, Felix Beaudoin, Philippe Perdu, Alan J. Weger, Moyra K. McManus, Peilin Song, Franco Stellari
    Faster IC Analysis with PICA Spatial Temporal Photon Correlation and CAD Autochanneling. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:9-11, pp:1663-1668 [Journal]
  8. Alberto Tosi, Franco Stellari, F. Zappa
    Innovative packaging technique for backside optical testing of wire-bonded chips. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:9-11, pp:1493-1498 [Journal]
  9. Franco Stellari, Peilin Song, John Hryckowian, Otto A. Torreiter, Steve Wilson, Phil Wu, Alberto Tosi
    Characterization of a 0.13 mum CMOS Link Chip using Time Resolved Emission (TRE). [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:9-11, pp:1550-1553 [Journal]

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