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Y. C. Chan: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Y. C. Chan
    FORTLOG = Fortran + Logique. [Citation Graph (0, 0)][DBLP]
    SPLT, 1985, pp:- [Conf]
  2. Y. C. Chan, P. L. Tu, K. C. Hung
    Study of the self-alignment of no-flow underfill for micro-BGA assembly. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:11, pp:1867-1875 [Journal]
  3. P. L. Tu, Y. C. Chan, K. C. Hung
    Reliability of microBGA assembly using no-flow underfill. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:12, pp:1993-2000 [Journal]
  4. P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai
    Study of micro-BGA solder joint reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:287-293 [Journal]
  5. Y. W. Chiu, Y. C. Chan, S. M. Lui
    Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:12, pp:1945-1951 [Journal]
  6. C. F. Luk, Y. C. Chan, K. C. Hung
    Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:3, pp:381-389 [Journal]
  7. Hua Lu, K. C. Hung, S. Stoyanov, C. Bailey, Y. C. Chan
    No-flow underfill flip chip assembly--an experimental and modeling analysis. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:8, pp:1205-1212 [Journal]
  8. C. F. Luk, Y. C. Chan, K. C. Hung
    Application of adhesive bonding techniques in hard disk drive head assembly. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:4-5, pp:767-777 [Journal]
  9. M. O. Alam, Y. C. Chan, K. C. Hung
    Reliability study of the electroless Ni-P layer against solder alloy. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:7, pp:1065-1073 [Journal]
  10. Y. C. Chan, D. Y. Luk
    Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:8, pp:1195-1204 [Journal]
  11. S. H. Fan, Y. C. Chan
    Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:7, pp:1081-1090 [Journal]
  12. Y. C. Chan, D. Y. Luk
    Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:8, pp:1185-1194 [Journal]
  13. M. N. Islam, Y. C. Chan, A. Sharif, M. O. Alam
    Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:12, pp:2031-2037 [Journal]
  14. J. H. Zhang, Y. C. Chan, M. O. Alam, S. Fu
    Contact resistance and adhesion performance of ACF interconnections to aluminum metallization. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:8, pp:1303-1310 [Journal]
  15. C. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey, Hua Lu
    The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:625-633 [Journal]
  16. C. W. Tan, Y. C. Chan, N. H. Yeung
    Behaviour of anisotropic conductive joints under mechanical loading. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:481-486 [Journal]
  17. C. W. Tan, Y. C. Chan, N. H. Yeung
    Effect of autoclave test on anisotropic conductive joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:2, pp:279-285 [Journal]
  18. C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So
    Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:5, pp:823-831 [Journal]
  19. M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan
    Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:3, pp:505-514 [Journal]
  20. Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu
    Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:295-302 [Journal]
  21. Rashed Adnan Islam, Y. C. Chan
    Effect of microwave preheating on the bonding performance of flip chip on flex joint. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:5, pp:815-821 [Journal]
  22. S. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan
    Thermal stability performance of anisotropic conductive film at different bonding temperatures. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:3, pp:495-503 [Journal]
  23. N. H. Yeung, Victor Lau, Y. C. Chan
    Bias-HAST on tape ball grid array (TBGA) test pattern. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:595-602 [Journal]
  24. M. J. Rizvi, Y. C. Chan, C. Bailey, H. Lu
    Study of anisotropic conductive adhesive joint behavior under 3-point bending. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:3-4, pp:589-596 [Journal]
  25. Rashed Adnan Islam, Y. C. Chan, W. Jillek, Samia Islam
    Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders. [Citation Graph (0, 0)][DBLP]
    Microelectronics Journal, 2006, v:37, n:8, pp:705-713 [Journal]

  26. A hybrid prognostics methodology for electronic products. [Citation Graph (, )][DBLP]


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