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Jamil A. Wakil: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Hendrik F. Hamann, Alan J. Weger, James Lacey, Zhigang Hu, Pradip Bose, Erwin Cohen, Jamil A. Wakil
    Temperature-limited microprocessors: Measurements and design implications. [Citation Graph (0, 0)][DBLP]
    VLSI Design, 2007, pp:427-432 [Conf]
  2. Edmund D. Blackshear, Moises Cases, Erich Klink, Stephen R. Engle, Ronald S. Malfatt, Daniel N. deAraujo, Stefano Oggioni, Luke D. Lacroix, Jamil A. Wakil, Nam H. Pham, Gareth G. Hougham, David J. Russell
    The evolution of build-up package technology and its design challenges. [Citation Graph (0, 0)][DBLP]
    IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:641-662 [Journal]
  3. Jamil A. Wakil
    Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:380-385 [Journal]

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