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Michael G. Pecht: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Ricky Valentin, Jeremy Cunningham, Michael D. Osterman, Abhijit Dasgupta II, Michael G. Pecht, Dinos Tsagos
    Weapon and communication systems: virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV). [Citation Graph (0, 0)][DBLP]
    Winter Simulation Conference, 2002, pp:948-953 [Conf]
  2. Michael D. Osterman, Michael G. Pecht
    Placement for reliability and routability of convectively cooled PWBs. [Citation Graph (0, 0)][DBLP]
    IEEE Trans. on CAD of Integrated Circuits and Systems, 1990, v:9, n:7, pp:734-744 [Journal]
  3. Bharatwaj Ramakrishnan, Peter Sandborn, Michael G. Pecht
    Process capability indices and product reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:12, pp:2067-2070 [Journal]
  4. Jingsong Xie, Michael G. Pecht, David DeDonato, Ali Hassanzadeh
    An investigation of the mechanical behavior of conductive elastomer interconnects. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:281-286 [Journal]
  5. Ninoslav Stojadinovic, Michael G. Pecht
    In memory of D. Stewart Peck. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:4, pp:481- [Journal]
  6. Ninoslav Stojadinovic, Michael G. Pecht
    Editorial. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:1, pp:1- [Journal]
  7. Dawn A. Thomas, Ken Ayers, Michael G. Pecht
    The "trouble not identified" phenomenon in automotive electronics. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:4-5, pp:641-651 [Journal]
  8. Leon Lantz, Seongdeok Hwang, Michael G. Pecht
    Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:8, pp:1163-1170 [Journal]
  9. Ninoslav Stojadinovic, Michael G. Pecht
    Editorial. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:4-5, pp:463- [Journal]
  10. Michael G. Pecht, Diganta Das, Arun Ramakrishnan
    The IEEE standards on reliability program and reliability prediction methods for electronic equipment. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1259-1266 [Journal]
  11. Ping Zhao, Michael G. Pecht
    Field failure due to creep corrosion on components with palladium pre-plated leadframes. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:775-783 [Journal]
  12. C. Hillman, B. Castillo, Michael G. Pecht
    Diffusion and absorption of corrosive gases in electronic encapsulants. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:635-643 [Journal]
  13. Arun Ramakrishnan, Michael G. Pecht
    Load characterization during transportation. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:333-338 [Journal]
  14. Daniel N. Donahoe, Michael G. Pecht, Isabel K. Lloyd, Sanka Ganesan
    Moisture induced degradation of multilayer ceramic capacitors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:400-408 [Journal]
  15. Mohammadreza Keimasi, Sanka Ganesan, Michael G. Pecht
    Low temperature electrical measurements of silicon bipolar monolithic microwave integrated circuit (MMIC) amplifiers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:326-334 [Journal]
  16. Tong Fang, Michael D. Osterman, Michael G. Pecht
    Statistical analysis of tin whisker growth. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:846-849 [Journal]
  17. Sanka Ganesan, Michael G. Pecht, Sharon Ling
    Use of high temperature operating life data to mitigate risks in long-duration space applications that deploy commercial-grade plastic encapsulated semiconductor devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:360-366 [Journal]
  18. Yuki Fukuda, Michael D. Osterman, Michael G. Pecht
    The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:1, pp:88-92 [Journal]
  19. Jingsong Xie, Michael G. Pecht
    Contact discontinuity modeling of electromechanical switches. [Citation Graph (0, 0)][DBLP]
    IEEE Transactions on Reliability, 2004, v:53, n:2, pp:279-283 [Journal]

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