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Markus Bschorr: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Peter Benkart, Alexander Kaiser, Andreas Munding, Markus Bschorr, Hans-Jörg Pfleiderer, Erhard Kohn, Arne Heittmann, Holger Huebner, Ulrich Ramacher
    3D Chip Stack Technology Using Through-Chip Interconnects. [Citation Graph (0, 0)][DBLP]
    IEEE Design & Test of Computers, 2005, v:22, n:6, pp:512-518 [Journal]

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