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Da-Yuan Shih:
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Publications of Author
- Peter A. Gruber, Luc Bélanger, Guy P. Brouillette, David H. Danovitch, Jean-Luc Landreville, David T. Naugle, Valerie A. Oberson, Da-Yuan Shih, Chris L. Tessler, Michel R. Turgeon
Low-cost wafer bumping. [Citation Graph (0, 0)][DBLP] IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:621-640 [Journal]
- Sung K. Kang, Paul Lauro, Da-Yuan Shih, Donald W. Henderson, Karl J. Puttlitz
Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications. [Citation Graph (0, 0)][DBLP] IBM Journal of Research and Development, 2005, v:49, n:4-5, pp:607-620 [Journal]
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