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Peck Cheng Lim: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang
    Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. [Citation Graph (0, 0)][DBLP]
    International Journal of Computational Engineering Science, 2003, v:4, n:2, pp:335-338 [Journal]
  2. Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong
    A Novel Wafer-Level Packaging Solution For Mems. [Citation Graph (0, 0)][DBLP]
    International Journal of Computational Engineering Science, 2003, v:4, n:2, pp:339-342 [Journal]
  3. Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong
    Wafer Bonding Process Based On The Taguchi Analysis. [Citation Graph (0, 0)][DBLP]
    International Journal of Computational Engineering Science, 2003, v:4, n:2, pp:331-334 [Journal]

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