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Peck Cheng Lim:
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Publications of Author
- Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang
Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. [Citation Graph (0, 0)][DBLP] International Journal of Computational Engineering Science, 2003, v:4, n:2, pp:335-338 [Journal]
- Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong
A Novel Wafer-Level Packaging Solution For Mems. [Citation Graph (0, 0)][DBLP] International Journal of Computational Engineering Science, 2003, v:4, n:2, pp:339-342 [Journal]
- Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong
Wafer Bonding Process Based On The Taguchi Analysis. [Citation Graph (0, 0)][DBLP] International Journal of Computational Engineering Science, 2003, v:4, n:2, pp:331-334 [Journal]
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