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Huamao Lin: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Wenjiang Zeng, Huamao Lin, Xiaolin Zhang, Ramasamy Chockalingam, Wee Chong Heng, Sangki Hong, Narayanan Balasubramanian
    Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices. [Citation Graph (0, 0)][DBLP]
    International Journal of Computational Engineering Science, 2003, v:4, n:2, pp:323-326 [Journal]

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