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Zhaowei Zhong: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Tong Yan Tee, Giovanni Frezza, Mayhuan Lim, Hun Shen Ng, Federico Ziglioli, Zhaowei Zhong
    Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn. [Citation Graph (0, 0)][DBLP]
    International Journal of Computational Engineering Science, 2003, v:4, n:2, pp:347-350 [Journal]
  2. Huimin Xie, Anand Asundi, Chai Gin Boay, Lu Yunguang, Jin Yu, Zhaowei Zhong, Bryan K. A. Ngoi
    High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:8, pp:1219-1227 [Journal]
  3. Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong
    Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1117-1123 [Journal]
  4. Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong
    Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:741-749 [Journal]
  5. Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong
    Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:8, pp:1329-1338 [Journal]
  6. Tong Yan Tee, Zhaowei Zhong
    Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:1, pp:105-114 [Journal]
  7. Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong
    Impact life prediction modeling of TFBGA packages under board level drop test. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:7, pp:1131-1142 [Journal]
  8. Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong
    Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:12, pp:2131-2138 [Journal]
  9. Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi
    Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:432-439 [Journal]
  10. Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong
    Dynamic responses and solder joint reliability under board level drop test. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:450-460 [Journal]

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