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Publications of Author

1. Takeaki Sugimura, Yuta Konishi, Yoshihiro Nakatani, Takafumi Fukushima, Hiroyuki Kurino, Mitsumasa Koyanagi
   Dynamic Multi-Context Reconfiguration Scheme for Reconfigurable Parallel Image Processing System with Three Dimensional Structure. [Citation Graph (0, 0)][DBLP]
   ARCS Workshops, 2005, pp:27-32 [Conf]
   
2. 
   Three-dimensional integration technology and integrated systems. [Citation Graph (, )][DBLP]
   
   
3. 
   Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch. [Citation Graph (, )][DBLP]
   
   
4. 
   A parallel ADC for high-speed CMOS image processing system with 3D structure. [Citation Graph (, )][DBLP]
   
   
5. 
   Heterogeneous integration technology for MEMS-LSI multi-chip module. [Citation Graph (, )][DBLP]
   
   
6. 
   Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. [Citation Graph (, )][DBLP]
   
   
7. 
   10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. [Citation Graph (, )][DBLP]