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Takafumi Fukushima: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Takeaki Sugimura, Yuta Konishi, Yoshihiro Nakatani, Takafumi Fukushima, Hiroyuki Kurino, Mitsumasa Koyanagi
    Dynamic Multi-Context Reconfiguration Scheme for Reconfigurable Parallel Image Processing System with Three Dimensional Structure. [Citation Graph (0, 0)][DBLP]
    ARCS Workshops, 2005, pp:27-32 [Conf]

  2. Three-dimensional integration technology and integrated systems. [Citation Graph (, )][DBLP]

  3. Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch. [Citation Graph (, )][DBLP]

  4. A parallel ADC for high-speed CMOS image processing system with 3D structure. [Citation Graph (, )][DBLP]

  5. Heterogeneous integration technology for MEMS-LSI multi-chip module. [Citation Graph (, )][DBLP]

  6. Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. [Citation Graph (, )][DBLP]

  7. 10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. [Citation Graph (, )][DBLP]

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