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Xingsheng Liu:
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- Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard
Stacked solder bumping technology for improved solder joint reliability. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2001, v:41, n:12, pp:1979-1992 [Journal]
- Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dusan Boroyevich, Guo-Quan Lu
Design issues of a three-dimensional packaging scheme for power modules. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2001, v:41, n:2, pp:295-305 [Journal]
- Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard
Effect of substrate flexibility on solder joint reliability. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2002, v:42, n:12, pp:1883-1891 [Journal]
- Y. C. Lin, X. Chen, Xingsheng Liu, Guo-Quan Lu
Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2005, v:45, n:1, pp:143-154 [Journal]
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