Search the dblp DataBase
Guo-Quan Lu: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]
Publications of Author
- Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard
Stacked solder bumping technology for improved solder joint reliability. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2001, v:41, n:12, pp:1979-1992 [Journal] - Shatil Haque, Guo-Quan Lu
Effects of device passivation materials on solderable metallization of IGBTs. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2001, v:41, n:5, pp:639-647 [Journal] - Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dusan Boroyevich, Guo-Quan Lu
Design issues of a three-dimensional packaging scheme for power modules. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2001, v:41, n:2, pp:295-305 [Journal] - Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard
Effect of substrate flexibility on solder joint reliability. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2002, v:42, n:12, pp:1883-1891 [Journal] - Y. C. Lin, X. Chen, Xingsheng Liu, Guo-Quan Lu
Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2005, v:45, n:1, pp:143-154 [Journal]
Search in 0.001secs, Finished in 0.001secs
| NOTICE1 |
|---|
| System may not be available sometimes or not working properly, since it is still in development with continuous upgrades |
| NOTICE2 |
|---|
| The rankings that are presented on this page should NOT be considered as formal since the citation info is incomplete in DBLP |
for Data Engineering Laboratory, Department of Informatics, Aristotle University © 2002