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P. L. Tu: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Y. C. Chan, P. L. Tu, K. C. Hung
    Study of the self-alignment of no-flow underfill for micro-BGA assembly. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:11, pp:1867-1875 [Journal]
  2. P. L. Tu, Y. C. Chan, K. C. Hung
    Reliability of microBGA assembly using no-flow underfill. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:12, pp:1993-2000 [Journal]
  3. P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai
    Study of micro-BGA solder joint reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:2, pp:287-293 [Journal]

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