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P. L. Tu:
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- Y. C. Chan, P. L. Tu, K. C. Hung
Study of the self-alignment of no-flow underfill for micro-BGA assembly. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2001, v:41, n:11, pp:1867-1875 [Journal]
- P. L. Tu, Y. C. Chan, K. C. Hung
Reliability of microBGA assembly using no-flow underfill. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2001, v:41, n:12, pp:1993-2000 [Journal]
- P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai
Study of micro-BGA solder joint reliability. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2001, v:41, n:2, pp:287-293 [Journal]
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