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K. C. Hung: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]
Publications of Author
- Y. C. Chan, P. L. Tu, K. C. Hung
Study of the self-alignment of no-flow underfill for micro-BGA assembly. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2001, v:41, n:11, pp:1867-1875 [Journal] - P. L. Tu, Y. C. Chan, K. C. Hung
Reliability of microBGA assembly using no-flow underfill. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2001, v:41, n:12, pp:1993-2000 [Journal] - P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai
Study of micro-BGA solder joint reliability. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2001, v:41, n:2, pp:287-293 [Journal] - C. F. Luk, Y. C. Chan, K. C. Hung
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2002, v:42, n:3, pp:381-389 [Journal] - Hua Lu, K. C. Hung, S. Stoyanov, C. Bailey, Y. C. Chan
No-flow underfill flip chip assembly--an experimental and modeling analysis. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2002, v:42, n:8, pp:1205-1212 [Journal] - C. F. Luk, Y. C. Chan, K. C. Hung
Application of adhesive bonding techniques in hard disk drive head assembly. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2002, v:42, n:4-5, pp:767-777 [Journal] - M. O. Alam, Y. C. Chan, K. C. Hung
Reliability study of the electroless Ni-P layer against solder alloy. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2002, v:42, n:7, pp:1065-1073 [Journal]
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