Thomas D. Moore, John L. Jarvis The effects of in-plane orthotropic properties in a multi-chip ball grid array assembly. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2002, v:42, n:6, pp:943-949 [Journal]
Thomas D. Moore, John L. Jarvis Erratum to "A simple and fundamental design rule for resisting delamination in bimaterial structures" [Microelectronics Reliability 2003;43: 487-494]. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2003, v:43, n:7, pp:1169- [Journal]
Thomas D. Moore, John L. Jarvis Thermomechanical deformation of a bimaterial plate--as applied to laminate IC assemblies. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2003, v:43, n:1, pp:155-162 [Journal]
Thomas D. Moore, John L. Jarvis A simple and fundamental design rule for resisting delamination in bimaterial structures. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2003, v:43, n:3, pp:487-494 [Journal]
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