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S. C. Hung: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. S. C. Hung, P. J. Zheng, S. H. Ho, S. C. Lee, H. N. Chen, J. D. Wu
    Board level reliability of PBGA using flex substrate. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:5, pp:677-687 [Journal]
  2. J. D. Wu, S. H. Ho, C. Y. Huang, C. C. Liao, P. J. Zheng, S. C. Hung
    Board level reliability of a stacked CSP subjected to cyclic bending. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:3, pp:407-416 [Journal]
  3. Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung
    Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:6, pp:925-934 [Journal]
  4. J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J. J. Lee
    A study in flip-chip UBM/bump reliability with effects of SnPb solder composition. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:1, pp:41-52 [Journal]

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