|
Search the dblp DataBase
F. Zappa:
[Publications]
[Author Rank by year]
[Co-authors]
[Prefers]
[Cites]
[Cited by]
Publications of Author
- Franco Stellari, F. Zappa, S. Cova, L. Vendrame
Tools for contactless testing and simulation of CMOS circuits. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2001, v:41, n:11, pp:1801-1808 [Journal]
- Alberto Tosi, Franco Stellari, F. Zappa, S. Cova
Backside Flip-Chip testing by means of high-bandwidth luminescence detection. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1669-1674 [Journal]
- Alberto Tosi, Franco Stellari, F. Zappa
Innovative packaging technique for backside optical testing of wire-bonded chips. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2005, v:45, n:9-11, pp:1493-1498 [Journal]
Search in 0.001secs, Finished in 0.001secs
|