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William J. Roesch: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. William J. Roesch
    Volume impacts on GaAs reliability improvement. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2001, v:41, n:8, pp:1123-1127 [Journal]
  2. William J. Roesch
    Methods of reducing defects in GaAs ICs. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:7, pp:1029-1036 [Journal]
  3. William J. Roesch, Suwanna Jittinorasett
    Cycling copper flip chip interconnects. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:7, pp:1047-1054 [Journal]
  4. William J. Roesch, Dorothy June M. Hamada
    Metal defect yield and reliability relationships. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1875-1881 [Journal]
  5. William J. Roesch
    Historical review of compound semiconductor reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1218-1227 [Journal]
  6. William J. Roesch
    Compound semiconductor activation energy in humidity. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:8, pp:1238-1246 [Journal]

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