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W. S. Leong:
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Publications of Author
- T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2002, v:42, n:3, pp:375-380 [Journal]
- T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2003, v:43, n:5, pp:803-809 [Journal]
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