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Publications of Author

1. T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai
   The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2002, v:42, n:3, pp:375-380 [Journal]
   
2. T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua
   Development of the green plastic encapsulation for high density wirebonded leaded packages. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:5, pp:811-817 [Journal]
   
3. Y. F. Yao, T. Y. Lin, K. H. Chua
   Improving the deflection of wire bonds in stacked chip scale package (CSP). [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:2039-2045 [Journal]
   
4. T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma
   The impact of moisture in mold compound preforms on the warpage of PBGA packages. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2004, v:44, n:4, pp:603-609 [Journal]
   
5. Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin
   New encapsulation development for fine pitch IC devices. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2005, v:45, n:7-8, pp:1222-1229 [Journal]