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R. Oh: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai
    The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:3, pp:375-380 [Journal]

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