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C. Bailey: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Hua Lu, K. C. Hung, S. Stoyanov, C. Bailey, Y. C. Chan
    No-flow underfill flip chip assembly--an experimental and modeling analysis. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:8, pp:1205-1212 [Journal]
  2. C. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey, Hua Lu
    The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:625-633 [Journal]
  3. M. J. Rizvi, Y. C. Chan, C. Bailey, H. Lu
    Study of anisotropic conductive adhesive joint behavior under 3-point bending. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:3-4, pp:589-596 [Journal]
  4. S. Stoyanov, R. Kay, C. Bailey, M. Desmulliez
    Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:1, pp:132-141 [Journal]
  5. D. Napoletani, D. C. Struppa, T. Sauer, V. Morozov, N. Vsevolodov, C. Bailey
    Functional dissipation microarrays for classification [Citation Graph (0, 0)][DBLP]
    CoRR, 2006, v:0, n:, pp:- [Journal]
  6. D. Napoletani, D. C. Struppa, T. Sauer, V. Morozov, N. Vsevolodov, C. Bailey
    Functional dissipation microarrays for classification. [Citation Graph (0, 0)][DBLP]
    Pattern Recognition, 2007, v:40, n:12, pp:3393-3400 [Journal]

  7. Open Ended Microwave Oven for Packaging [Citation Graph (, )][DBLP]


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